Inventor · disambiguated record
Koichi Hatakeyama
Also filed as: HATAKEYAMA KOICHI
25 granted patents·13 pending applications·200 citations·filing 1982–2023
95Inventor score
Top patents by PatentIndex Score
38 records- 0188US8274143B2Semiconductor device, method of forming the same, and electronic deviceFUJISHIMA HIROYUKI·Filed 2010·Granted Sep 25, 2012·22 cites·21 claims
- 0288US6699337B2Copper-base alloys having improved punching properties on press and a process for producing themDOWA MINING CO·Filed 2001·Granted Mar 2, 2004·22 cites·17 claims
- 0381USD837399SCell culture vesselFUJIFILM CORP·Filed 2017·Granted Jan 1, 2019·25 cites·1 claims
- 0478US7054834B2Online distribution system and methodNEC CORP·Filed 2001·Granted May 30, 2006·16 cites·2 claims
- 0577US9466546B2Semiconductor device and method of forming the sameHATAKEYAMA KOICHI·Filed 2011·Granted Oct 11, 2016·5 cites·26 claims
- 0676US8504434B2Communication device, communication method, and communication systemHATAKEYAMA KOICHI·Filed 2011·Granted Aug 6, 2013·2 cites·14 claims
- 0775US6183144B1Instant photo film packFUJI PHOTO FILM CO LTD·Filed 1999·Granted Feb 6, 2001·13 cites·11 claims
- 0868US8203222B2Semiconductor device and method of manufacturing the sameWATANABE MITSUHISA·Filed 2009·Granted Jun 19, 2012·4 cites·23 claims
- 0968US6132529ALeadframe made of a high-strength, high-electroconductivity copper alloyDOWA MINING CO·Filed 1997·Granted Oct 17, 2000·33 cites·19 claims
- 1066US11168642B2Cylinder liner for cast-covering, and method for manufacturing cylinder blockTPR CO LTD·Filed 2018·Granted Nov 9, 2021·0 cites·8 claims
- 1166US5814168AProcess for producing high-strength, high-electroconductivity copper-base alloysDOWA MINING CO·Filed 1996·Granted Sep 29, 1998·30 cites·16 claims
- 1265US8706563B2Communication methodSONY CORP·Filed 2013·Granted Apr 22, 2014·0 cites·1 claims
- 1364US9124312B2Communication device, reader/writer device, communication system, and communication methodHATAKEYAMA KOICHI·Filed 2011·Granted Sep 1, 2015·2 cites·10 claims
- 1461US11499498B2Cylinder liner and manufacturing method for sameTPR CO LTD·Filed 2019·Granted Nov 15, 2022·0 cites·19 claims
- 1561US11047333B2Cylinder liner, block manufacturing method and cylinder liner manufacturing methodTPR CO LTD·Filed 2019·Granted Jun 29, 2021·0 cites·6 claims
- 1661US9550977B2Method for producing auricular cartilage tissueGUNZE KK·Filed 2012·Granted Jan 24, 2017·1 cites·4 claims
- 1760US10876494B2Cylinder liner, block manufacturing method and cylinder liner manufacturing methodTPR CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·6 claims
- 1860US10428407B2Cylindrical member made of flake graphite cast ironTPR CO LTD·Filed 2016·Granted Oct 1, 2019·0 cites·20 claims
- 1959US12220907B2Printing apparatus, control method, program, information processing apparatus, and printing systemSEIKO INSTR INC·Filed 2023·Granted Feb 11, 2025·0 cites·6 claims
- 2059US2014231006A1Pressure-sensitive adhesive label, method of manufacturing pressure-sensitive adhesive label, and label issuing deviceSEIKO INSTR INC·Filed 2014·Application pending·0 cites
- 2159US2014209593A1Pressure-sensitive adhesive force expressing unit, pressure-sensitive adhesive label issuing device, and printerSEIKO INSTR INC·Filed 2014·Application pending·0 cites
- 2259US2014209595A1Pressure-sensitive adhesive force expressing unit, pressure-sensitive adhesive label issuing device, printer, pressure-sensitive adhesive force expressing method, and pressure-sensitive adhesive force expressing programSEIKO INSTR INC·Filed 2014·Application pending·0 cites
- 2358US2003065680A1Data providing system and data providing methodNEC CORP·Filed 2002·Application pending·0 cites
- 2457US2002178059A1Information providing system and providing method thereofNEC CORP·Filed 2002·Application pending·0 cites
- 2555US2002002507A1Simple payment system and method for merchandise purchased by mobile telephone terminalNEC CORP·Filed 2001·Application pending·0 cites
- 2652US10936269B2Printing system, printer, and printing control methodSEIKO INSTR INC·Filed 2019·Granted Mar 2, 2021·0 cites·8 claims
- 2747US2014230998A1Pressure-sensitive adhesive label, method of manufacturing pressure-sensitive adhesive label, and label issuing deviceSEIKO INSTR INC·Filed 2014·Application pending·0 cites
- 2845US6064829ACounter device for sheet photo film packFUJI PHOTO FILM CO LTD·Filed 1998·Granted May 16, 2000·3 cites·19 claims
- 2944US2014319778A1Gasket device for pre-filled syringeFUJIFILM CORP·Filed 2014·Application pending·0 cites
- 3042US2016329304A1Semiconductor device and method of manufacturing semiconductor devicePS4 LUXCO SARL·Filed 2014·Application pending·0 cites
- 3142US2010085408A1Printing method for thermal printer, computer program, and thermal printer apparatusHATAKEYAMA KOICHI·Filed 2009·Application pending·0 cites
- 3240US10596624B2Cast-iron cylindrical member and composite structureTPR CO LTD·Filed 2017·Granted Mar 24, 2020·0 cites·18 claims
- 3339US11141783B1Cylinder liner for insert castingTPR CO LTD·Filed 2021·Granted Oct 12, 2021·0 cites·6 claims
- 3437US4406218ACooking utensilJUSCO KABUSHIKI KAISHA·Filed 1982·Granted Sep 27, 1983·12 cites·7 claims
- 3537US2010252923A1Semiconductor device and method of manufacturing sameELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 3636US2010301468A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 3735US2012118939A1Process and apparatus for manufacturing semiconductor deviceKUSANAGI KEIYO·Filed 2011·Application pending·0 cites
- 3831US6289123B1Character extracting method and its apparatusSHARP KK·Filed 1998·Granted Sep 11, 2001·10 cites·22 claims
Join the waitlist — get patent alerts
Get an alert when Koichi Hatakeyama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →