Inventor · disambiguated record

Kohei Higashiguchi

Also filed as: HIGASHIGUCHI KOHEI

4 granted patents·2 pending applications·1 citations·filing 2017–2020

55Inventor score

Technology areasH10W

Files withMITSUBISHI GAS CHEMICAL CO6

Top patents by PatentIndex Score

6 records

0162US10808103B2Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layerMITSUBISHI GAS CHEMICAL CO·Filed 2017·Granted Oct 20, 2020·1 cites·19 claims
0245US11935803B2Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Mar 19, 2024·0 cites·27 claims
0338US2022389130A1Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
0434US11924979B2Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Mar 5, 2024·0 cites·26 claims
0534US11053382B2Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2017·Granted Jul 6, 2021·0 cites·22 claims
0634US2021147680A1Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →