Inventor · disambiguated record
Koshi Himeda
Also filed as: HIMEDA KOSHI
15 granted patents·13 pending applications·3 citations·filing 2011–2025
84Inventor score
Top patents by PatentIndex Score
28 records- 0185US11437182B2Electronic component and method of manufacturing electronic componentMURATA MANUFACTURING CO·Filed 2018·Granted Sep 6, 2022·2 cites·6 claims
- 0270US10777667B2Semiconductor deviceMURATA MANUFACTURING CO·Filed 2019·Granted Sep 15, 2020·1 cites·20 claims
- 0368US11552020B2Semiconductor composite device and package board used thereinMURATA MANUFACTURING CO·Filed 2021·Granted Jan 10, 2023·0 cites·17 claims
- 0466US2025166931A1Capacitor arrayMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 0564US2024379280A1Inductor component and inductor component-embedded substrateMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0664US2024355532A1Coil, inductor component, and inductor arrayMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0764US2024355537A1Inductor component and inductor arrayMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0864US2024355533A1Coil, inductor component, and inductor arrayMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0963US2024355527A1Package substrate and inductor componentMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1062US12308181B2Capacitor element, module, and semiconductor composite deviceMURATA MANUFACTURING CO·Filed 2024·Granted May 20, 2025·0 cites·25 claims
- 1160US11121123B2Semiconductor composite device and package board used thereinMURATA MANUFACTURING CO·Filed 2020·Granted Sep 14, 2021·0 cites·19 claims
- 1260US2025167676A1Dcdc converter moduleMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 1358US12278197B2Package boardMURATA MANUFACTURING CO·Filed 2022·Granted Apr 15, 2025·0 cites·16 claims
- 1457US2025125098A1Capacitor elementMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1556US11817493B2Semiconductor deviceMURATA MANUFACTURING CO·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 1656US11398341B2Electronic componentMURATA MANUFACTURING CO·Filed 2018·Granted Jul 26, 2022·0 cites·16 claims
- 1756US2025181812A1Substrate design assisting device, substrate design assisting system, and data structure related to circuit informationMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 1856US2024420899A1Electronic componentMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1955US12334884B2Power amplification device and an RF circuit moduleMURATA MANUFACTURING CO·Filed 2021·Granted Jun 17, 2025·0 cites·20 claims
- 2054US2024380324A1Voltage converterMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 2152US11863128B2Power amplifier circuitMURATA MANUFACTURING CO·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 2251US11145607B2Semiconductor chipMURATA MANUFACTURING CO·Filed 2020·Granted Oct 12, 2021·0 cites·20 claims
- 2351US2025240869A1Electronic deviceMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 2447US11515442B2Optical semiconductor elementMURATA MANUFACTURING CO·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 2546US12009273B2Semiconductor apparatus including different thermal resistance values for different heat transfer pathsMURATA MANUFACTURING CO·Filed 2020·Granted Jun 11, 2024·0 cites·22 claims
- 2646US2022157748A1Radio frequency moduleMURATA MANUFACTURING CO·Filed 2022·Application pending·0 cites
- 2743US12363923B2Passive componentMURATA MANUFACTURING CO·Filed 2021·Granted Jul 15, 2025·0 cites·16 claims
- 2828US8933497B2Semiconductor switch device and method of manufacturing semiconductor switch deviceSAIMEI TSUNEKAZU·Filed 2011·Granted Jan 13, 2015·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →