Inventor · disambiguated record
Kouji Igarashi
Also filed as: IGARASHI KOUJI
7 granted patents·3 pending applications·100 citations·filing 1996–2020
79Inventor score
Top patents by PatentIndex Score
10 records- 0174US10340172B2Semiconductor wafer surface protection film and method for manufacturing semiconductor deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2016·Granted Jul 2, 2019·2 cites·19 claims
- 0273US5807174AMethod of assisting player in entering commands in video game, video game system, video game storage medium, and method of controlling video gameKONAMI CO LTD·Filed 1996·Granted Sep 15, 1998·93 cites·15 claims
- 0370US9822284B2Adhesive film and method for manufacturing semiconductor deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2014·Granted Nov 21, 2017·3 cites·10 claims
- 0469US11848215B2Method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2019·Granted Dec 19, 2023·1 cites·11 claims
- 0562US11034864B2Adhesive film having adhesive resin layers and method of manufacturing electronic apparatus using the adhesive filmMITSUI CHEMICALS TOHCELLO INC·Filed 2018·Granted Jun 15, 2021·1 cites·5 claims
- 0656US2022213349A1Adhesive film and method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2020·Application pending·0 cites
- 0743US11840652B2Adhesive film and method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2019·Granted Dec 12, 2023·0 cites·8 claims
- 0841US2016141197A1Method of peeling electronic member and laminateMITSUI CHEMICALS TOHCELLO INC·Filed 2014·Application pending·0 cites
- 0936US2007167003A1Adhesive film and method for forming metal film using sameMITSUI CHEMICALS INC·Filed 2004·Application pending·0 cites
- 1035US7238421B2Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive filmMITSUI CHEMICALS INC·Filed 2003·Granted Jul 3, 2007·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →