Inventor · disambiguated record
Ko Inaba
Also filed as: INABA KO
4 granted patents·2 pending applications·10 citations·filing 2006–2021
63Inventor score
Top patents by PatentIndex Score
6 records- 0174US8227536B2Lead-free solder paste and its useWATANABE SHIZUHARU·Filed 2006·Granted Jul 24, 2012·10 cites·11 claims
- 0263US11628519B2Solder jointLENOVO SINGAPORE PTE LTD·Filed 2021·Granted Apr 18, 2023·0 cites·6 claims
- 0360US10987764B2Flux and solder pasteSENJU METAL INDUSTRY CO·Filed 2018·Granted Apr 27, 2021·0 cites·16 claims
- 0450US11097379B2Solder bonding method and solder jointLENOVO SINGAPORE PTE LTD·Filed 2019·Granted Aug 24, 2021·0 cites·7 claims
- 0537US2009301760A1Method of Soldering a Module BoardSHIMAMURA MASATO·Filed 2006·Application pending·0 cites
- 0636US2017304961A1Solder Paste and Solder JointSENJU METAL INDUSTRY CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →