Inventor · disambiguated record
Kouichi Inoue
Also filed as: INOUE KOUICHI
33 granted patents·11 pending applications·506 citations·filing 1985–2022
97Inventor score
Files withTERUMO CORP6FUJI HEAVY IND LTD3INOUE KOUICHI3SINTOKOGIO LTD3SONY SEMICONDUCTOR SOLUTIONS CORP3
Top patents by PatentIndex Score
44 records- 0196US5498167ABoard to board electrical connectorsMOLEX INC·Filed 1994·Granted Mar 12, 1996·131 cites·12 claims
- 0289US5998967ALithium-ion battery packROHM CO LTD·Filed 1999·Granted Dec 7, 1999·156 cites·7 claims
- 0388US9836835B2Imaging apparatus for diagnosis, information processing apparatus, and control method thereof, program thereof, and computer-readable storage medium thereofTERUMO CORP·Filed 2015·Granted Dec 5, 2017·10 cites·20 claims
- 0486US9572496B2Imaging apparatus for diagnosis, information processing apparatus, control method thereof, program and computer-readable storage mediumTERUMO CORP·Filed 2015·Granted Feb 21, 2017·10 cites·16 claims
- 0585US7751016B2Display device having alignment marks with particular shapes for attaching substrate and FPCHITACHI DISPLAYS LTD·Filed 2007·Granted Jul 6, 2010·12 cites·20 claims
- 0685US6559232B2Thermoplastic resin compositionRIKEN TECHNOS CORP·Filed 2001·Granted May 6, 2003·25 cites·8 claims
- 0782US7493982B2Control device for a four-wheel drive vehicleFUJI HEAVY IND LTD·Filed 2006·Granted Feb 24, 2009·12 cites·4 claims
- 0881US7735666B2Open/close cap and manufacturing method thereofHOSOKAWA YOKO KK·Filed 2005·Granted Jun 15, 2010·12 cites·14 claims
- 0978US8804087B2Liquid crystal display device with relationship of a width of conductive thermocompression bonding tape to a width of a bonding thereof to an external conductive film and to an earth padNAMIKI SATOSHI·Filed 2012·Granted Aug 12, 2014·4 cites·6 claims
- 1078US5507657AElectrical connector coverMOLEX INC·Filed 1994·Granted Apr 16, 1996·40 cites·8 claims
- 1176US9703156B2Liquid crystal display deviceJAPAN DISPLAY INC·Filed 2014·Granted Jul 11, 2017·2 cites·7 claims
- 1271US8779586B2Die bond film, dicing die bond film, and semiconductor deviceOONISHI KENJI·Filed 2011·Granted Jul 15, 2014·4 cites·15 claims
- 1370US8430822B2Blood pressure measuring apparatus and method of controlling the sameINOUE KOUICHI·Filed 2010·Granted Apr 30, 2013·6 cites·4 claims
- 1467US9477123B2Liquid crystal display device and production method thereofJAPAN DISPLAY INC·Filed 2013·Granted Oct 25, 2016·1 cites·11 claims
- 1566US12471397B2Imaging element and imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Nov 11, 2025·0 cites·18 claims
- 1666US9230868B2Warp correction device and warp correction method for semiconductor element substrateSINTOKOGIO LTD·Filed 2015·Granted Jan 5, 2016·1 cites·6 claims
- 1764US9493708B2Process for producing caking additive for coke production and process for producing cokeNAKAMURA YOSHIKAZU·Filed 2010·Granted Nov 15, 2016·2 cites·11 claims
- 1861US9136192B2Warp correction device and warp correction method for semiconductor element substrateINOUE KOUICHI·Filed 2012·Granted Sep 15, 2015·1 cites·12 claims
- 1960US4666981AResin compositions and products using the sameTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1985·Granted May 19, 1987·13 cites·11 claims
- 2059US10906481B2ProtectorTOYOTA MOTOR CO LTD·Filed 2019·Granted Feb 2, 2021·1 cites·7 claims
- 2158US5924188AMethod of manufacturing bottomed hollow cylinder using a pressMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jul 20, 1999·23 cites·13 claims
- 2254US12166056B2Photoelectric conversion element and photoelectric conversion deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Dec 10, 2024·0 cites·27 claims
- 2352US2015001131A1Process for producing caking additive for coke production and process for producing cokeJX NIPPON OIL & ENERGY CORP·Filed 2014·Application pending·0 cites
- 2448US6735464B2Electrocardiograph system and its communication deviceTERUMO CORP·Filed 2001·Granted May 11, 2004·2 cites·20 claims
- 2547US2019202029A1Drilling method, resist layer, and fiber-reinforced plasticSINTOKOGIO LTD·Filed 2017·Application pending·0 cites
- 2647US2023219193A1Method for manufacturing component made of hard brittle material and component made of hard brittle materialSINTOKOGIO LTD·Filed 2022·Application pending·0 cites
- 2747US2010304092A1Method of manufacturing dicing die-bonding filmAMANO YASUHIRO·Filed 2009·Application pending·0 cites
- 2846US7468016B2Characteristics correction system for automatic transmissionFUJI HEAVY IND LTD·Filed 2004·Granted Dec 23, 2008·4 cites·17 claims
- 2946US7387727B2Contaminated liquid filtration system vehicleZEOTEK RES INST LTD·Filed 2003·Granted Jun 17, 2008·5 cites·14 claims
- 3046US6861153B2Thermoplastic resin compositionRIKEN TECHNOS CORP·Filed 2003·Granted Mar 1, 2005·0 cites·10 claims
- 3144US6282677B1Interleaving apparatusOKI ELECTRIC IND CO LTD·Filed 1999·Granted Aug 28, 2001·10 cites·6 claims
- 3243US5986865ABattery protection device and a battery device employing such a battery protection deviceROHM CO LTD·Filed 1998·Granted Nov 16, 1999·18 cites·10 claims
- 3341US2008066205A1Method of Producing Young Moss Seedlings, Method of Producing Moss Mat and Young Moss SeedlingsHERO CORP·Filed 2005·Application pending·0 cites
- 3440US8348851B2Blood pressure measurement device and control method of the sameTERUMO CORP·Filed 2010·Granted Jan 8, 2013·0 cites·6 claims
- 3540US2022246659A1Imaging device and imaging apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Application pending·0 cites
- 3638US10646174B2Imaging apparatus for diagnosis, method of controlling the same, program, and computer readable storage mediumTERUMO CORP·Filed 2015·Granted May 12, 2020·0 cites·20 claims
- 3738US10524652B2Information processing device, imaging system, information processing method and programTERUMO CORP·Filed 2016·Granted Jan 7, 2020·0 cites·18 claims
- 3838US8430821B2Blood pressure measuring apparatusINOUE KOUICHI·Filed 2010·Granted Apr 30, 2013·0 cites·6 claims
- 3936US2011074050A1Film for semiconductor deviceAMANO YASUHIRO·Filed 2010·Application pending·0 cites
- 4033US2004064239A1Power distribution control apparatus for four wheel drive vehicleFUJI HEAVY IND LTD·Filed 2003·Application pending·0 cites
- 4133US2011120614A1Thermosetting adhesive film, adhesive film with dicing film, and method of manufacturing semiconductor device using the thermosetting adhesive film or the adhesive film with dicing filmSUGO YUKI·Filed 2010·Application pending·0 cites
- 4231US5210619AChroma phase modulatorTOSHIBA KK·Filed 1992·Granted May 11, 1993·1 cites·16 claims
- 4331US2011256666A1Thermosetting die bond film, dicing die bond film and semiconductor deviceSUGO YUKI·Filed 2011·Application pending·0 cites
- 4426US2011057331A1Thermosetting die bonding film, dicing die bonding film and semiconductor deviceHAYASHI MIKI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →