Inventor · disambiguated record
Koichi Ishikawa
Also filed as: ISHIKAWA KOICHI
14 granted patents·10 pending applications·177 citations·filing 1992–2023
91Inventor score
Top patents by PatentIndex Score
24 records- 0190US6769697B1GasketACE INC·Filed 2000·Granted Aug 3, 2004·67 cites·4 claims
- 0287US5560253AShift lever assembly for manual transmissionTSUDA IND·Filed 1995·Granted Oct 1, 1996·54 cites·9 claims
- 0381US10816104B2Solenoid valve for hydraulic control deviceNIDEC TOSOK CORP·Filed 2018·Granted Oct 27, 2020·4 cites·11 claims
- 0465US8900511B2High-strength nonmagnetic stainless steel, and high-strength nonmagnetic stainless steel part and process for producing the sameISHIKAWA KOICHI·Filed 2008·Granted Dec 2, 2014·1 cites·12 claims
- 0565US7055808B2Vaporizing reactant liquids for chemical vapor deposition film processingAPPLIED MATERIALS INC·Filed 2002·Granted Jun 6, 2006·8 cites·26 claims
- 0663US2025198050A1Reaction Furnace for Producing Polycrystalline Silicon Rod, Gas Supply Nozzle, Production Method of Polycrystalline Silicon Rod, and Polycrystalline Silicon RodTOKUYAMA CORP·Filed 2023·Application pending·0 cites
- 0760US12345462B2Low-temperature storage systemTSUBAKIMOTO CHAIN CO·Filed 2023·Granted Jul 1, 2025·0 cites·7 claims
- 0860US12325590B2Low-temperature storage systemTSUBAKIMOTO CHAIN CO·Filed 2023·Granted Jun 10, 2025·0 cites·8 claims
- 0957US6667005B2Corrosion resistant steelISHIDA KIYOHITO·Filed 2002·Granted Dec 23, 2003·3 cites·10 claims
- 1057US2023002237A1Apparatus and method for producing polycrystalline silicon, and polycrystalline siliconTOKUYAMA CORP·Filed 2020·Application pending·0 cites
- 1153US2007292612A1Metal-organic vaporizing and feeding apparatus, metal-organic chemical vapor deposition apparatus, metal-organic chemical vapor deposition method, gas flow rate regulator, semiconductor manufacturing apparatus, and semiconductor manufacturing methodSOKEN IND·Filed 2007·Application pending·0 cites
- 1252US2008089804A1Martensitic free cutting stainless steelDAIDO STEEL CO LTD·Filed 2007·Application pending·0 cites
- 1351US5580432AJig for electroplating lead pins of an integrated circuit packageNGK SPARK PLUG CO·Filed 1995·Granted Dec 3, 1996·18 cites·17 claims
- 1449US2022152615A1Low-temperature storage systemTSUBAKIMOTO CHAIN CO·Filed 2022·Application pending·0 cites
- 1547US2005098240A1Ferritic free-cutting stainless steel excellent in surface roughness and outgass resistanceDAIDO STEEL CO LTD·Filed 2004·Application pending·0 cites
- 1644US2004081575A1Corrosion resistant steel having good cold-workability and machinabilityFiled 2003·Application pending·0 cites
- 1743US2010272593A1High corrosion-resistant, high-strength and non-magnetic stainless steel, high corrosion-resistant, high-strength and non-magnetic stainless steel product and method for producing the sameDAIDO STEEL CO LTD·Filed 2010·Application pending·0 cites
- 1841US10767780B2Solenoid valve having a structure with less fluid leakageNIDEC TOSOK CORP·Filed 2018·Granted Sep 8, 2020·0 cites·5 claims
- 1941US7052835B2Method of screening a geneUNIV SCHOOL NIHON JURIDIC PER·Filed 2002·Granted May 30, 2006·0 cites·9 claims
- 2041US5459102AMethod of electroplating lead pins of integrated circuit packageNGK SPARK PLUG CO·Filed 1994·Granted Oct 17, 1995·11 cites·6 claims
- 2140US2010002876A1Encryption apparatus, decryption apparatus, licensing apparatus and content data generation methodKYOCERA CORP·Filed 2007·Application pending·0 cites
- 2239US2009087269A1Cutting toolAISIN AW CO·Filed 2008·Application pending·0 cites
- 2333US5305890ACirculatory storage apparatusMARUSHIN COMPANY LIMITED·Filed 1992·Granted Apr 26, 1994·11 cites·12 claims
- 2430US8726356B2Authentication apparatus, authentication method, and authentication program implementing the methodKONYA YUKO·Filed 2008·Granted May 13, 2014·0 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Koichi Ishikawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →