Inventor · disambiguated record
Koutarou Iwata
Also filed as: IWATA KOUTAROU
0 granted patents·3 pending applications·0 citations·filing 2014–2022
Files withMITSUBISHI MATERIALS CORP3
Top patents by PatentIndex Score
3 records- 0157US2024321806A1Bonding paste, bonding layer, bonded body, and method for producing bonded bodyMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 0245US2015343569A1Sn-ag-cu-based solder powder and solder paste using said powderMITSUBISHI MATERIALS CORP·Filed 2014·Application pending·0 cites
- 0341US2022093553A1Joined structureMITSUBISHI MATERIALS CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →