Inventor · disambiguated record
Koichi Kagesawa
Also filed as: KAGESAWA Koichi
0 granted patents·4 pending applications·0 citations·filing 2023–2023
Technology areasH10P
Files withRESONAC CORP4
Top patents by PatentIndex Score
4 records- 0174US2025263593A1Abrasive grains and method for selecting same, polishing liquid, multi-liquid type polishing liquid, polishing method, component manufacturing method, and semiconductor component manufacturing methodRESONAC CORP·Filed 2023·Application pending·0 cites
- 0274US2025263594A1Raw material for obtaining abrasive grains and method for selecting same, abrasive grain production method, polishing solution production method, polishing method, component production method, and semiconductor component productionRESONAC CORP·Filed 2023·Application pending·0 cites
- 0374US2025257253A1Abrasive grain, selection method therefor, polishing agent, multi-liquid polishing agent, polishing method, component manufacturing method, and semiconductor component manufacturing methodRESONAC CORP·Filed 2023·Application pending·0 cites
- 0471US2025257252A1Raw material for obtaining abrasive grains and selection method therefor, production method for abrasive grains, production method for polishing liquid, polishing method, production method for component, and production method for semiconductor componentRESONAC CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →