Inventor · disambiguated record
Kok Meng Kam
Also filed as: KAM KOK MENG
3 granted patents·1 pending application·0 citations·filing 2021–2022
43Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0166US12470185B2Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the sameWOLFSPEED INC·Filed 2022·Granted Nov 11, 2025·0 cites·31 claims
- 0253US11935879B2Integrated passive device (IPD) components and a package and processes implementing the sameCREE INC·Filed 2021·Granted Mar 19, 2024·0 cites·56 claims
- 0351US12119239B2Packaged semiconductor devices, and package molds for forming packaged semiconductor devicesWOLFSPEED INC·Filed 2021·Granted Oct 15, 2024·0 cites·12 claims
- 0450US2024105390A1Device and process for implementing silicon carbide (sic) surface mount devicesWOLFSPEED INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →