Inventor · disambiguated record
Koji Kamei
Also filed as: KAMEI KOJI
40 granted patents·9 pending applications·323 citations·filing 1996–2024
97Inventor score
Top patents by PatentIndex Score
49 records- 0196US6595802B1Connector capable of considerably suppressing a high-frequency currentNEC TOKIN CORP·Filed 2001·Granted Jul 22, 2003·105 cites·25 claims
- 0292US7741653B2Gallium nitride-based compound semiconductor light-emitting deviceSHOWA DENKO KK·Filed 2006·Granted Jun 22, 2010·21 cites·23 claims
- 0389US11293115B2Method for producing a SiC epitaxial wafer containing a total density of large pit defects and triangular defects of 0.01 defects/cm2 or more and 0.6 defects/cm2 or lessSHOWA DENKO KK·Filed 2017·Granted Apr 5, 2022·5 cites·6 claims
- 0488US9157225B2Flush toiletTOTO LTD·Filed 2014·Granted Oct 13, 2015·8 cites·20 claims
- 0587US7952116B2Gallium nitride-based compound semiconductor light-emitting deviceSHOWA DENKO KK·Filed 2010·Granted May 31, 2011·5 cites·16 claims
- 0686US11320388B2SiC epitaxial wafer containing large pit defects with a surface density of 0.5 defects/CM2 or less, and production method thereforSHOWA DENKO KK·Filed 2017·Granted May 3, 2022·4 cites·7 claims
- 0784US2025215610A1SiC INGOT AND METHOD FOR MANUFACTURING SiC SUBSTRATERESONAC CORP·Filed 2024·Application pending·0 cites
- 0882US8049243B2Gallium nitride-based compound semiconductor light emitting deviceSHOWA DENKO KK·Filed 2005·Granted Nov 1, 2011·11 cites·14 claims
- 0978US8093605B2Gallium nitride-based compound semiconductor light-emitting device with an electrode covered by an over-coating layerKAMEI KOJI·Filed 2006·Granted Jan 10, 2012·9 cites·7 claims
- 1074US11315839B2Evaluation method and manufacturing method of SiC epitaxial waferSHOWA DENKO KK·Filed 2018·Granted Apr 26, 2022·1 cites·13 claims
- 1174US10065321B2Robot service cooperation system, platform and methodADVANCED TELECOMMUNICATIONS RES INSTITUTE INTERNATIONAL·Filed 2014·Granted Sep 4, 2018·4 cites·6 claims
- 1274US7759690B2Gallium nitride-based compound semiconductor light-emitting deviceSHOWA DENKO KK·Filed 2006·Granted Jul 20, 2010·5 cites·19 claims
- 1373US7544974B2Positive electrode for compound semiconductor light-emitting deviceSHOWA DENKO KK·Filed 2005·Granted Jun 9, 2009·5 cites·7 claims
- 1472US10955350B2SiC wafer defect measuring method, reference sample, and method of manufacturing SiC epitaxial waferSHOWA DENKO KK·Filed 2017·Granted Mar 23, 2021·1 cites·13 claims
- 1570US11961736B2SiC epitaxial wafer, production method therefor, and defect identification methodSHOWA DENKO KK·Filed 2022·Granted Apr 16, 2024·0 cites·4 claims
- 1670US8748903B2Semiconductor light emitting element and method for manufacturing semiconductor light emitting elementKAMEI KOJI·Filed 2010·Granted Jun 10, 2014·2 cites·8 claims
- 1770US2023268177A1SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SAMESHOWA DENKO KK·Filed 2023·Application pending·0 cites
- 1868US7964660B2Process for producing aqueous pigment dispersionKAO CORP·Filed 2006·Granted Jun 21, 2011·1 cites·8 claims
- 1968US6635819B2Electronic component comprising a metallic case provided with a magnetic loss materialNEC TOKIN CORP·Filed 2001·Granted Oct 21, 2003·16 cites·23 claims
- 2067US6723914B1Composite magnetic tapeNEC TOKIN CORP·Filed 2000·Granted Apr 20, 2004·10 cites·5 claims
- 2167US5898346ADual-band nonreversible circuit device comprising two nonreversible circuit elements contained in a single housing to be operable in different frequency bandsTOKIN CORP·Filed 1996·Granted Apr 27, 1999·18 cites·2 claims
- 2266US8866186B2Group III nitride semiconductor light-emitting deviceORIJI GAKU·Filed 2006·Granted Oct 21, 2014·4 cites·25 claims
- 2366US6362434B1Magnetic prepreg, its manufacturing method and printed wiring board employing the prepregTOKIN CORP·Filed 1997·Granted Mar 26, 2002·21 cites·8 claims
- 2465US10865500B2SiC epitaxial wafer and method for manufacturing SiC epitaxial waferSHOWA DENKO KK·Filed 2016·Granted Dec 15, 2020·1 cites·4 claims
- 2565US6703778B2Light emitting element, plasma display panel, and CRT display device capable of considerably suppressing a high-frequency noiseNEC TOKIN CORP·Filed 2001·Granted Mar 9, 2004·6 cites·33 claims
- 2665US2022223482A1EVALUATION METHOD AND MANUFACTURING METHOD OF SiC EPITAXIAL WAFERSHOWA DENKO KK·Filed 2022·Application pending·0 cites
- 2764US11249027B2SiC substrate evaluation method and method for manufacturing SiC epitaxtal waferSHOWA DENKO KK·Filed 2020·Granted Feb 15, 2022·0 cites·5 claims
- 2864US9359753B2Flush toiletTOTO LTD·Filed 2014·Granted Jun 7, 2016·1 cites·14 claims
- 2962US6903440B2Electronic component of a high frequency current suppression type and bonding wire for the sameNEC TOKIN CORP·Filed 2003·Granted Jun 7, 2005·7 cites·25 claims
- 3061US8829555B2Semiconductor light emission elementKAMEI KOJI·Filed 2009·Granted Sep 9, 2014·2 cites·20 claims
- 3160US6921573B2High-frequency current suppression body using magnetic loss material exhibiting outstanding complex permeability characteristicsNEC TOKIN CORP·Filed 2001·Granted Jul 26, 2005·10 cites·16 claims
- 3259US11705329B2SiC epitaxial wafer and method for manufacturing sameSHOWA DENKO KK·Filed 2018·Granted Jul 18, 2023·0 cites·9 claims
- 3359US6810584B2Heat-shrinkable tube, heat-shrinkable sheet, and method of shrinking the sameNEC TOKIN CORP·Filed 2001·Granted Nov 2, 2004·3 cites·16 claims
- 3458US10697898B2SiC substrate evaluation method and method for manufacturing SiC epitaxial waferSHOWA DENKO KK·Filed 2019·Granted Jun 30, 2020·0 cites·4 claims
- 3558US7875896B2Transparent positive electrodeSHOWA DENKO KK·Filed 2005·Granted Jan 25, 2011·1 cites·10 claims
- 3658US6635961B2Electronic component of a high frequency current suppression type and bonding wire for the sameNEC TOKIN CORP·Filed 2001·Granted Oct 21, 2003·6 cites·23 claims
- 3757US8524801B2Water-based ink for inkjet printingYOSHIDA HIROYUKI·Filed 2009·Granted Sep 3, 2013·0 cites·10 claims
- 3856US2025390714A1Question recommendation apparatus, question recommendation method, and programNIPPON TELEGRAPH & TELEPHONE·Filed 2022·Application pending·0 cites
- 3954US10985042B2SiC substrate, SiC epitaxial wafer, and method of manufacturing the sameSHOWA DENKO KK·Filed 2019·Granted Apr 20, 2021·0 cites·5 claims
- 4050US7452740B2Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereofSHOWA DENKO KK·Filed 2004·Granted Nov 18, 2008·4 cites·1 claims
- 4150US2009263922A1Reflective Positive Electrode And Gallium Nitride-Based Compound Semiconductor Light-Emitting Device Using The SameSHOWA DENKO KK·Filed 2009·Application pending·0 cites
- 4248US6011887AOptical fiber cableTOKIN CORP·Filed 1997·Granted Jan 4, 2000·13 cites·9 claims
- 4344US2004150342A1Light emitting element, plasma display panel, and CRT display device capable of considerably suppressing a high-frequency noiseFiled 2004·Application pending·0 cites
- 4443US6051156ACompound magnetic material and electromagnetic interference suppressorTOKIN CORP·Filed 1997·Granted Apr 18, 2000·7 cites·6 claims
- 4542US2008283850A1Reflective Positive Electrode and Gallium Nitride-Based Compound Semiconductor Light-Emitting Device Using the SameKAMEI KOJI·Filed 2005·Application pending·0 cites
- 4640US2007170461A1Gallium nitride-based compound semiconductor light-emitting deviceKAMEI KOJI·Filed 2005·Application pending·0 cites
- 4737US7518163B2Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereofSHOWA DENKO KK·Filed 2004·Granted Apr 14, 2009·0 cites·22 claims
- 4837US6310285B1EMI preventive part and active device with the sameTOKIN CORP·Filed 1997·Granted Oct 30, 2001·6 cites·9 claims
- 4937US2007137377A1Collapsible steering column device having telescopic mechanismKAMEI KOJI·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →