Inventor · disambiguated record
Koujiro Kameyama
Also filed as: KAMEYAMA KOUJIRO
20 granted patents·2 pending applications·180 citations·filing 2004–2009
94Inventor score
Files withSANYO ELECTRIC CO10KANTO SANYO SEMICONDUCTORS CO3KAMEYAMA KOUJIRO2SEKI KATSUYUKI2SUZUKI AKIRA2
Top patents by PatentIndex Score
22 records- 0190US7795115B2Method of manufacturing semiconductor deviceSANYO ELECTRIC CO·Filed 2006·Granted Sep 14, 2010·17 cites·19 claims
- 0287US7732925B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Jun 8, 2010·14 cites·8 claims
- 0387US7183589B2Semiconductor device with a resin-sealed optical semiconductor elementKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Feb 27, 2007·44 cites·3 claims
- 0485US7728438B2Optical semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2006·Granted Jun 1, 2010·13 cites·18 claims
- 0582US7256497B2Semiconductor device with a barrier layer and a metal layerSANYO ELECTRIC CO·Filed 2005·Granted Aug 14, 2007·9 cites·18 claims
- 0681US7566588B2Semiconductor device with a resin-sealed optical semiconductor elementSANYO ELECTRIC CO·Filed 2006·Granted Jul 28, 2009·9 cites·14 claims
- 0779US7397128B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2006·Granted Jul 8, 2008·11 cites·5 claims
- 0878US8278213B2Semiconductor device and manufacturing method of the sameKAMEYAMA KOUJIRO·Filed 2005·Granted Oct 2, 2012·18 cites·9 claims
- 0976US7241679B2Method of manufacturing semiconductor deviceSANYO ELECTRIC CO·Filed 2005·Granted Jul 10, 2007·6 cites·13 claims
- 1075US8173543B2Method of forming hole in semiconductor device using maskSEKI KATSUYUKI·Filed 2007·Granted May 8, 2012·5 cites·6 claims
- 1173US8148788B2Semiconductor device and method of manufacturing the sameSUZUKI AKIRA·Filed 2009·Granted Apr 3, 2012·6 cites·9 claims
- 1271US7750478B2Semiconductor device with via hole of uneven widthSANYO ELECTRIC CO·Filed 2007·Granted Jul 6, 2010·4 cites·10 claims
- 1363US7264997B2Semiconductor device including inclined cut surface and manufacturing method thereofKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Sep 4, 2007·12 cites·31 claims
- 1460US8187949B2Semiconductor device and method of manufacturing the sameKAMEYAMA KOUJIRO·Filed 2008·Granted May 29, 2012·2 cites·14 claims
- 1559US8227901B2Mesa type semiconductor device and manufacturing method thereofSEKI KATSUYUKI·Filed 2009·Granted Jul 24, 2012·2 cites·11 claims
- 1657US8669183B2Manufacturing method of semiconductor deviceSUZUKI AKIRA·Filed 2007·Granted Mar 11, 2014·1 cites·6 claims
- 1753US7056768B2Cutting method and method of manufacturing semiconductor deviceKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Jun 6, 2006·6 cites·14 claims
- 1852US8076755B2Semiconductor device and method of manufacturing the sameUMEMOTO MITSUO·Filed 2008·Granted Dec 13, 2011·1 cites·7 claims
- 1952US6899802B2Method for recycling of plating solutionsSANYO ELECTRIC CO·Filed 2004·Granted May 31, 2005·0 cites·8 claims
- 2045US7772043B2Plating apparatus, plating method and manufacturing method for semiconductor deviceSANYO ELECTRIC CO·Filed 2007·Granted Aug 10, 2010·0 cites·14 claims
- 2139US2004245530A1Optical semiconductor device and method of manufacturing sameFiled 2004·Application pending·0 cites
- 2237US2007215938A1Semiconductor device and manufacturing method of the sameSANYO SEMICONDUCTOR CO LTD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →