Inventor · disambiguated record
Kouji Kawakita
Also filed as: KAWAKITA KOUJI
24 granted patents·3 pending applications·1,068 citations·filing 1989–2022
97Inventor score
Top patents by PatentIndex Score
27 records- 0197US5484647AConnecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jan 16, 1996·212 cites·9 claims
- 0295US12291234B2Path planning device, path planning method, computer program productDENSO CORP·Filed 2022·Granted May 6, 2025·2 cites·12 claims
- 0393US6222302B1Piezoelectric actuator, infrared sensor and piezoelectric light deflectorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Apr 24, 2001·108 cites·49 claims
- 0492US5652042AConductive paste compound for via hole filling, printed circuit board which uses the conductive pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jul 29, 1997·111 cites·15 claims
- 0592US5440075ATwo-sided printed circuit board a multi-layered printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Aug 8, 1995·115 cites·16 claims
- 0690US6096411AConductive paste composition for via hole filling and printed circuit board using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Aug 1, 2000·73 cites·14 claims
- 0789US5972482APrinted circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Oct 26, 1999·57 cites·15 claims
- 0888US6822534B2Laminated electronic component, laminated duplexer and communication deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 23, 2004·27 cites·41 claims
- 0986US5977490AConductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Nov 2, 1999·66 cites·4 claims
- 1082US6108903AConnecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Aug 29, 2000·42 cites·30 claims
- 1181US5914358AConductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jun 22, 1999·49 cites·10 claims
- 1273US5817404APrinted circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Oct 6, 1998·37 cites·15 claims
- 1373US5733467AConductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Mar 31, 1998·33 cites·21 claims
- 1471US6227051B1Acceleration sensorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted May 8, 2001·13 cites·10 claims
- 1567US5006956ADielectric ceramic compositionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1989·Granted Apr 9, 1991·19 cites·5 claims
- 1666US5588207AMethod of manufacturing two-sided and multi-layered printed circuit boardsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Dec 31, 1996·31 cites·36 claims
- 1762US6326694B1Printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Dec 4, 2001·15 cites·32 claims
- 1858US11345369B2Vehicle control method and systemDENSO CORP·Filed 2020·Granted May 31, 2022·0 cites·10 claims
- 1958US5960538APrinted circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 5, 1999·20 cites·10 claims
- 2056US12252128B2Trajectory generation device, trajectory generation method, and computer program productDENSO CORP·Filed 2022·Granted Mar 18, 2025·0 cites·22 claims
- 2153US6211487B1Printed circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 3, 2001·11 cites·38 claims
- 2249US6050144AAcceleration sensorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Apr 18, 2000·11 cites·5 claims
- 2343US5093757ADielectric ceramic compositionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Mar 3, 1992·9 cites·5 claims
- 2440US2001003610A1Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the sameFiled 2001·Application pending·0 cites
- 2540US2001002294A1Printed circuit board and method of manufacturing the sameFiled 2000·Application pending·0 cites
- 2637US6154356ALaminated ceramic deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Nov 28, 2000·7 cites·8 claims
- 2728US2001035253A1Ceramic sintered body and production method thereofFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →