Inventor · disambiguated record
Koji Koike
Also filed as: KOIKE KOJI
12 granted patents·1 pending application·71 citations·filing 1996–2012
90Inventor score
Top patents by PatentIndex Score
13 records- 0177US8841753B2Semiconductor device having seal wiringTAKEMURA KOJI·Filed 2012·Granted Sep 23, 2014·4 cites·25 claims
- 0275US7538433B2Semiconductor devicePANASONIC CORP·Filed 2006·Granted May 26, 2009·5 cites·20 claims
- 0373US8164163B2Semiconductor device having sealing ringTAKEMURA KOJI·Filed 2008·Granted Apr 24, 2012·5 cites·27 claims
- 0470US8237281B2Semiconductor deviceTAKEMURA KOJI·Filed 2011·Granted Aug 7, 2012·2 cites·26 claims
- 0570US8044482B2Semiconductor devicePANASONIC CORP·Filed 2009·Granted Oct 25, 2011·3 cites·13 claims
- 0669US7888801B2Semiconductor devicePANASONIC CORP·Filed 2009·Granted Feb 15, 2011·3 cites·17 claims
- 0765US8102056B2Semiconductor device having pads and which minimizes defects due to bonding and probing processesTAKEMURA KOJI·Filed 2006·Granted Jan 24, 2012·3 cites·23 claims
- 0865US5642852AMethod of ultrasonic weldingYAZAKI CORP·Filed 1996·Granted Jul 1, 1997·24 cites·7 claims
- 0962US6294255B1Method of and structure for fixing a flexible electrical conductorYAZAKI CORP·Filed 2000·Granted Sep 25, 2001·14 cites·1 claims
- 1058US7521801B2Semiconductor devicePANASONIC CORP·Filed 2006·Granted Apr 21, 2009·1 cites·19 claims
- 1147US8810039B2Semiconductor device having a pad and plurality of interconnectsTAKEMURA KOJI·Filed 2011·Granted Aug 19, 2014·0 cites·30 claims
- 1243US2009051035A1Semiconductor integrated circuitHIRANO HIROSHIGE·Filed 2008·Application pending·0 cites
- 1338US6156138AMethod of and structure for fixing a flexible electrical conductorYAZAKI CORP·Filed 1998·Granted Dec 5, 2000·7 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →