Inventor · disambiguated record
Kouji Kondo
Also filed as: KONDO KOUJI
4 granted patents·1 pending application·73 citations·filing 1999–2017
74Inventor score
Top patents by PatentIndex Score
5 records- 0184US6228467B1Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrateMITSUBISHI PLASTICS INC·Filed 1999·Granted May 8, 2001·59 cites·12 claims
- 0280US11454054B2Lock deviceNIFCO INC·Filed 2017·Granted Sep 27, 2022·6 cites·7 claims
- 0373US8143529B2Laminated multi-layer circuit boardHARADA TOSHIKAZU·Filed 2007·Granted Mar 27, 2012·8 cites·15 claims
- 0448US2009057265A1Method of manufacturing multilayer printed circuit boardDENSO CORP·Filed 2008·Application pending·0 cites
- 0543US7733665B2Multi-layer substrate having conductive pattern and resin film and method for manufacturing the sameDENSO CORP·Filed 2006·Granted Jun 8, 2010·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →