Inventor · disambiguated record
Koji Kondo
Also filed as: KONDO KOJI
78 granted patents·10 pending applications·1,499 citations·filing 1983–2024
99Inventor score
Top patents by PatentIndex Score
88 records- 0196US6464585B1Sound generating device and video game device using the sameNINTENDO CO LTD·Filed 1988·Granted Oct 15, 2002·119 cites·19 claims
- 0292US6988244B1Image generating apparatus and methodSONY CORP·Filed 2000·Granted Jan 17, 2006·75 cites·16 claims
- 0392US6851091B1Image display apparatus and methodSONY CORP·Filed 2000·Granted Feb 1, 2005·57 cites·11 claims
- 0492US5914132APharmaceutical dosage form with multiple enteric polymer coatings for colonic deliveryPROCTER & GAMBLE·Filed 1996·Granted Jun 22, 1999·128 cites·17 claims
- 0591US7378745B2Package substrate for a semiconductor device having thermoplastic resin layers and conductive patternsNEC ELECTRONICS CORP·Filed 2005·Granted May 27, 2008·39 cites·21 claims
- 0691US6641898B2Printed wiring board and method of manufacturing a printed wiring boardDENSO CORP·Filed 2001·Granted Nov 4, 2003·51 cites·8 claims
- 0790US6680441B2Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric deviceDENSO CORP·Filed 2002·Granted Jan 20, 2004·44 cites·24 claims
- 0888US7169998B2Sound generation device and sound generation programNINTENDO CO LTD·Filed 2003·Granted Jan 30, 2007·56 cites·21 claims
- 0987US6734877B1Image display apparatus and methodSONY CORP·Filed 2000·Granted May 11, 2004·61 cites·12 claims
- 1083US6818836B2Printed circuit board and its manufacturing methodDENSO CORP·Filed 2002·Granted Nov 16, 2004·27 cites·13 claims
- 1182US7356917B2Method for manufacturing multi-layer printed circuit boardDENSO CORP·Filed 2005·Granted Apr 15, 2008·11 cites·3 claims
- 1281US6768061B2Multilayer circuit boardDENSO CORP·Filed 2002·Granted Jul 27, 2004·23 cites·14 claims
- 1381US5511719AProcess of joining metal membersNIPPON DENSO CO·Filed 1994·Granted Apr 30, 1996·45 cites·5 claims
- 1480US6713687B2Printed wiring board and method for manufacturing printed wiring boardDENSO CORP·Filed 2001·Granted Mar 30, 2004·24 cites·12 claims
- 1579US6848178B2Enhancement of current-carrying capacity of a multilayer circuit boardDENSO CORP·Filed 2003·Granted Feb 1, 2005·34 cites·11 claims
- 1679US5405656ASolution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductorNIPPON DENSO CO·Filed 1993·Granted Apr 11, 1995·40 cites·16 claims
- 1778US12477662B2Printed wiring boardIBIDEN CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 1877US7602759B2Wireless LAN system making quality of communication improve and a communication method thereforOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Oct 13, 2009·7 cites·7 claims
- 1976US6485369B2Video game apparatus outputting image and music and storage medium used thereforNINTENDO CO LTD·Filed 2001·Granted Nov 26, 2002·19 cites·13 claims
- 2075US4573833ANozzle device for cutting fluid for machine toolsMATSURA KIKAI SEISAKUSHO KK·Filed 1983·Granted Mar 4, 1986·21 cites·2 claims
- 2174US7323238B2Printed circuit board having colored outer layerDENSO CORP·Filed 2005·Granted Jan 29, 2008·7 cites·14 claims
- 2274US7165321B2Method for manufacturing printed wiring board with embedded electric deviceDENSO CORP·Filed 2003·Granted Jan 23, 2007·15 cites·7 claims
- 2374US7036214B2Manufacturing method of rigid-flexible printed circuit board and structure thereofDENSO CORP·Filed 2003·Granted May 2, 2006·19 cites·11 claims
- 2474US6667443B2Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing methodDENSO CORP·Filed 2001·Granted Dec 23, 2003·18 cites·13 claims
- 2574US6043986APrinted circuit board having a plurality of via-holesNIPPON DENSO CO·Filed 1996·Granted Mar 28, 2000·49 cites·2 claims
- 2673US7605502B2Automotive alternator with rectifier having high-strength heat sinksDENSO CORP·Filed 2006·Granted Oct 20, 2009·6 cites·20 claims
- 2772US7188412B2Method for manufacturing printed wiring boardDENSO CORP·Filed 2003·Granted Mar 13, 2007·15 cites·9 claims
- 2872US6636989B1Electronic control apparatus and method for on-board rewriting of non-volatile memoriesDENSO CORP·Filed 2000·Granted Oct 21, 2003·26 cites·17 claims
- 2972US5039338AElectroless copper plating solution and process for formation of copper filmNIPPON DENSO CO·Filed 1989·Granted Aug 13, 1991·29 cites·13 claims
- 3071US10715016B2Winding device and winding methodNITTOKU ENG·Filed 2017·Granted Jul 14, 2020·1 cites·6 claims
- 3170US7240429B2Manufacturing method for a printed circuit boardDENSO CORP·Filed 2004·Granted Jul 10, 2007·12 cites·8 claims
- 3270US6280329B1Video game apparatus outputting image and music and storage medium used thereforNINTENDO CO LTD·Filed 1999·Granted Aug 28, 2001·44 cites·24 claims
- 3370US5843479ABisacodyl dosage form with multiple enteric polymer coatings for colonic deliveryPROCTER & GAMBLE·Filed 1996·Granted Dec 1, 1998·36 cites·17 claims
- 3469US6972070B2Method of manufacturing a printed wiring boardDENSO CORP·Filed 2003·Granted Dec 6, 2005·12 cites·3 claims
- 3568US9818533B2Winding apparatusNITTOKU ENG·Filed 2013·Granted Nov 14, 2017·1 cites·4 claims
- 3668US8396164B2Receiving device including impedance control circuit and semiconductor device including impedance control circuitSUZUKI YOUICHIROU·Filed 2009·Granted Mar 12, 2013·4 cites·1 claims
- 3768US7012197B2Multi-layer printed circuit board and method for manufacturing the sameDENSO CORP·Filed 2004·Granted Mar 14, 2006·10 cites·7 claims
- 3867US6303878B1Mounting structure of electronic component on substrate boardDENSO CORP·Filed 1998·Granted Oct 16, 2001·34 cites·9 claims
- 3966US10293732B2Container holder including a swing member rotatably supporting a roller to hold a container received thereinHONDA MOTOR CO LTD·Filed 2016·Granted May 21, 2019·2 cites·7 claims
- 4066US4834796AElectroless copper plating solution and process for electrolessly plating copperNIPPON DENSO CO·Filed 1987·Granted May 30, 1989·27 cites·12 claims
- 4163US6784577B2Vehicular AC current generator rotor having field-coil winding finishing-end hook portionsDENSO CORP·Filed 2002·Granted Aug 31, 2004·11 cites·19 claims
- 4263US4754908AProcess for preparing a tape guide cylinderTANAKA MASAMITSU·Filed 1986·Granted Jul 5, 1988·16 cites·19 claims
- 4362US5669548ASoldering methodNIPPON DENSO CO·Filed 1996·Granted Sep 23, 1997·22 cites·10 claims
- 4460US8810101B2Electric rotary machine having claw magnetic poles with flanges having centrifugal force resistanceKONDO KOJI·Filed 2009·Granted Aug 19, 2014·3 cites·7 claims
- 4559US7328505B2Method for manufacturing multilayer circuit boardDENSO CORP·Filed 2004·Granted Feb 12, 2008·6 cites·6 claims
- 4659US5965211AElectroless copper plating solution and process for formation of copper filmNIPPON DENSO CO·Filed 1991·Granted Oct 12, 1999·21 cites·5 claims
- 4758US12104099B2Bonded structure and method for producing sameDENSO CORP·Filed 2021·Granted Oct 1, 2024·0 cites·12 claims
- 4858US7876006B2Alternator for vehicleDENSO CORP·Filed 2007·Granted Jan 25, 2011·1 cites·18 claims
- 4957US8283833B2Rotor for electric rotary machineKONDO KOJI·Filed 2009·Granted Oct 9, 2012·2 cites·3 claims
- 5057US6855625B2Manufacturing method of multilayer substrateDENSO CORP·Filed 2003·Granted Feb 15, 2005·6 cites·27 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →