Inventor · disambiguated record
Ko-Yi Lee
Also filed as: LEE KO-YI
6 granted patents·2 pending applications·33 citations·filing 2004–2018
75Inventor score
Files withTAIWAN SEMICONDUCTOR MFG4TAIWAN SEMICONDUCTOR MFG CO LTD2HONGFUJIN PREC ELECTRONICS(CHONGQING)CO LTD1HONGFUJIN PREC IND SHENZHEN1
Top patents by PatentIndex Score
8 records- 0181US7148574B2Bonding pad structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Dec 12, 2006·30 cites·13 claims
- 0262US7939824B2Test structureTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted May 10, 2011·2 cites·19 claims
- 0357US7498680B2Test structureTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 3, 2009·1 cites·11 claims
- 0446US9431356B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 30, 2016·0 cites·17 claims
- 0546US2007042593A1Bonding pad structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 0643US10283468B1Package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 7, 2019·0 cites·20 claims
- 0729US2018275812A1Split touch device, touch screen data transmission system and methodHONGFUJIN PREC ELECTRONICS CHONGQING CO LTD·Filed 2017·Application pending·0 cites
- 0827US10085204B2Data transmission system and communication methodHONGFUJIN PREC IND SHENZHEN·Filed 2015·Granted Sep 25, 2018·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →