Inventor · disambiguated record
Ko Han Lin
Also filed as: LIN KO HAN
2 granted patents·1 pending application·0 citations·filing 2020–2024
30Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC3
Top patents by PatentIndex Score
3 records- 0173US2025087614A1Bump coplanarity for semiconductor device assembly and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0272US12154879B2Bump coplanarity for semiconductor device assembly and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2023·Granted Nov 26, 2024·0 cites·19 claims
- 0362US11742309B2Bump coplanarity for semiconductor device assembly and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 29, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →