Inventor · disambiguated record
Ko-Cheng Liu
Also filed as: LIU KO-CHENG
13 granted patents·13 pending applications·4 citations·filing 2014–2025
83Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD23SILICONWARE PRECISION INDUSTRIES CO LTD2COMPAL ELECTRONICS INC1
Top patents by PatentIndex Score
26 records- 0194US12166071B2Dielectric fins with air gap and backside self-aligned contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 10, 2024·2 cites·20 claims
- 0280US2025366155A1Protection layer for reducing sti loss and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0376US2025318194A1Multi-gate device including semiconductor fin between dielectric fins and method of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0475US2025311303A1Isolation for Multigate DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0574US2024379744A1Dielectric fins with air gap and backside self-aligned contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0674US2024379816A1Multi-Channel Devices and Method with Anti-Punch Through ProcessTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0774US2024379813A1Semiconductor Devices with Air Gaps and the Method ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0873US2025366154A1Protection layer for reducing sti loss and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0970US12414331B2Isolation for multigate devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 1068US2023387198A1Source/drain spacer with air gap in semiconductor devices and methods of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1167US12324218B2Semiconductor devices with air gaps and the method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 3, 2025·0 cites·20 claims
- 1266US12414330B2Multi-gate device including semiconductor fin between dielectric fins and method of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 1366US12278276B2Multi-channel devices and method with anti-punch through processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 15, 2025·0 cites·20 claims
- 1466US9900996B2Package substrate and structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 20, 2018·2 cites·17 claims
- 1566US2025203949A1Semiconductor Structure With Recessed Top Semiconductor Layer In Substrate And Method Of Fabricating The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1664US11837631B2Source/drain spacer with air gap in semiconductor devices and methods of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 1762US12230720B2Semiconductor structure with recessed top semiconductor layer in substrate and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 1862US11688768B2Integrated circuit structure with source/drain spacersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 1959US12183806B2Semiconductor devices and methods of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 2056US11600695B2Dielectric fins with air gap and backside self-aligned contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·20 claims
- 2156US2025254123A1Load balancing system and methodCOMPAL ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 2256US2024339362A1Multi-gate devices with improved performance and methods of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2355US12513979B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 2455US2024113198A1Method of modulating multi-gate device channels and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2553US2024162331A1Structure and method for multi-gate semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2647US9520351B2Packaging substrate and package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 13, 2016·0 cites·36 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →