Inventor · disambiguated record
Koji Makihara
Also filed as: MAKIHARA KOJI
1 granted patent·3 pending applications·0 citations·filing 2013–2017
3Inventor score
Technology areasH10W
Files withSUMITOMO BAKELITE CO4
Top patents by PatentIndex Score
4 records- 0125US10259976B2Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsinkSUMITOMO BAKELITE CO·Filed 2016·Granted Apr 16, 2019·0 cites·21 claims
- 0222US2015060889A1Semiconductor device, die attach material, and method for manufacturing semiconductor deviceSUMITOMO BAKELITE CO·Filed 2013·Application pending·0 cites
- 0318US2019264070A1Thermally conductive paste and electronic deviceSUMITOMO BAKELITE CO·Filed 2017·Application pending·0 cites
- 0418US2019338171A1Thermally conductive paste and electronic deviceSUMITOMO BAKELITE CO·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →