Inventor · disambiguated record
Koichiro Masuda
Also filed as: MASUDA KOICHIRO
14 granted patents·3 pending applications·177 citations·filing 2001–2012
93Inventor score
Top patents by PatentIndex Score
17 records- 0185US6899840B2Process for making pre-formed objectsPROCTER & GAMBLE·Filed 2002·Granted May 31, 2005·17 cites·13 claims
- 0282USD525879SCosmetic packagePROCTER & GAMBLE·Filed 2003·Granted Aug 1, 2006·25 cites·1 claims
- 0382US7037570B2Pre-formed objectsPROCTER & GAMBLE·Filed 2005·Granted May 2, 2006·2 cites·3 claims
- 0482US7021031B2Process for making pre-formed objectsPROCTER & GAMBLE·Filed 2005·Granted Apr 4, 2006·2 cites·5 claims
- 0581US6873518B2Shielded strip line device and method of manufacture thereofNEC CORP·Filed 2003·Granted Mar 29, 2005·26 cites·10 claims
- 0681US6717793B2Surface mount type condenserNEC TOKIN CORP·Filed 2002·Granted Apr 6, 2004·32 cites·16 claims
- 0776US8174116B2Spacer, and its manufacturing methodMASUDA KOICHIRO·Filed 2008·Granted May 8, 2012·8 cites·11 claims
- 0872US6646523B2Distributed constant type noise filterNEC TOKIN CORP·Filed 2001·Granted Nov 11, 2003·19 cites·14 claims
- 0970US6721171B2Shielded strip line device and method of manufacture thereofNEC CORP·Filed 2002·Granted Apr 13, 2004·14 cites·6 claims
- 1067US7315226B2Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming sameNEC CORP·Filed 2003·Granted Jan 1, 2008·12 cites·21 claims
- 1166US8441774B2Capacitance element, printed circuit board, semiconductor package, and semiconductor circuitMASUDA KOICHIRO·Filed 2008·Granted May 14, 2013·4 cites·36 claims
- 1266USD535196SCosmetic packagePROCTER & GAMBLE·Filed 2005·Granted Jan 16, 2007·13 cites·1 claims
- 1365US7242265B2Element of parallel flat plate line type, a circuit boardNEC CORP·Filed 2005·Granted Jul 10, 2007·3 cites·13 claims
- 1453US2012198673A1Helical capacitor and manufacturing method thereofMASUDA KOICHIRO·Filed 2012·Application pending·0 cites
- 1550US2008053692A1Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming sameNEC CORP·Filed 2007·Application pending·0 cites
- 1647US8279578B2Helical capacitor and manufacturing method thereofMASUDA KOICHIRO·Filed 2007·Granted Oct 2, 2012·0 cites·32 claims
- 1738US2009021886A1Multilayer strip line capacitive elementNEC CORP·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →