Inventor · disambiguated record
Kouji Matsui
Also filed as: MATSUI KOUJI
5 granted patents·168 citations·filing 1998–2010
83Inventor score
Top patents by PatentIndex Score
5 records- 0194US6662442B1Process for manufacturing printed wiring board using metal plating techniquesNITTO DENKO CORP·Filed 2000·Granted Dec 16, 2003·100 cites·7 claims
- 0289US8198140B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageMURAI HIDEYA·Filed 2010·Granted Jun 12, 2012·14 cites·12 claims
- 0372US7816782B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageNEC CORP·Filed 2005·Granted Oct 19, 2010·4 cites·21 claims
- 0456US6313533B1Function element, substrate for mounting function element thereon, and method of connecting them to each otherNEC CORP·Filed 1999·Granted Nov 6, 2001·22 cites·19 claims
- 0549US6618694B1Method, apparatus and computer program product for forming data to be analyzed by finite element method and calculation method based on finite element methodNEC CORP·Filed 1998·Granted Sep 9, 2003·28 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when Kouji Matsui files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →