Inventor · disambiguated record
Koso Matsuno
Also filed as: MATSUNO KOSO
18 granted patents·4 pending applications·39 citations·filing 2006–2023
90Inventor score
Top patents by PatentIndex Score
22 records- 0180US7785500B2Electrically conductive adhesivePANASONIC CORP·Filed 2006·Granted Aug 31, 2010·9 cites·7 claims
- 0276US11822168B2Photocurable composition and liquid crystal display devicePANASONIC IP MAN CO LTD·Filed 2019·Granted Nov 21, 2023·1 cites·5 claims
- 0376US8378472B2Mounting structure for semiconductor element with underfill resinPANASONIC CORP·Filed 2008·Granted Feb 19, 2013·7 cites·9 claims
- 0475US8138426B2Mounting structureMATSUNO KOSO·Filed 2008·Granted Mar 20, 2012·9 cites·14 claims
- 0574US11970631B2Conductive paste and conductive film formed using the samePANASONIC IP MAN CO LTD·Filed 2022·Granted Apr 30, 2024·0 cites·5 claims
- 0671US12508677B2Solder paste and bonded structurePANASONIC IP MAN CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·7 claims
- 0771US8319108B2Mounting structure and electronic equipmentYAMAGUCHI ATSUSHI·Filed 2009·Granted Nov 27, 2012·5 cites·13 claims
- 0866US8410377B2Mounted structureYAMAGUCHI ATSUSHI·Filed 2008·Granted Apr 2, 2013·3 cites·4 claims
- 0965US8344268B2Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the samePANASONIC CORP·Filed 2009·Granted Jan 1, 2013·4 cites·7 claims
- 1063US11618110B2Solder paste and mounting structurePANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 4, 2023·0 cites·6 claims
- 1162US11053328B2Photocurable compositionPANASONIC IP MAN CO LTD·Filed 2020·Granted Jul 6, 2021·0 cites·9 claims
- 1258US11623307B2Resin flux solder paste and mount structurePANASONIC IP MAN CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·9 claims
- 1355US8179686B2Mounted structural body and method of manufacturing the sameSAKATANI SHIGEAKI·Filed 2008·Granted May 15, 2012·1 cites·12 claims
- 1454US2021121992A1Solder paste and joining structurePANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 1553US12028986B2Mounting method and mounting structure formed by the samePANASONIC IP MAN CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·6 claims
- 1648US8482931B2Package structureKUWABARA RYO·Filed 2009·Granted Jul 9, 2013·0 cites·17 claims
- 1748US8345444B2Structure with electronic component mounted therein and method for manufacturing such structurePANASONIC CORP·Filed 2008·Granted Jan 1, 2013·0 cites·14 claims
- 1846US2021309829A1Curable resin composition and mounting structurePANASONIC IP MAN CO LTD·Filed 2019·Application pending·0 cites
- 1943US2020040131A1Photocurable resin composition, adhesive, stacked structure, method for fabricating the stacked structure, and display devicePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 2042US8992726B2Method and device for peeling off silicon wafersPANASONIC CORP·Filed 2013·Granted Mar 31, 2015·0 cites·4 claims
- 2140US2019232438A1Solder paste and mount structurePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 2232US8867228B2Electrode bonding structure, and manufacturing method for electrode bonding structureKATSURA HIROAKI·Filed 2012·Granted Oct 21, 2014·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →