Inventor · disambiguated record
Koichi Meguro
Also filed as: MEGURO KOICHI
4 granted patents·2 pending applications·34 citations·filing 2002–2012
70Inventor score
Top patents by PatentIndex Score
6 records- 0169US7056770B2Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin materialFUJITSU LTD·Filed 2003·Granted Jun 6, 2006·19 cites·9 claims
- 0268US6673654B2Method of manufacturing semiconductor device using heated conveyance memberFUJITSU LTD·Filed 2002·Granted Jan 6, 2004·15 cites·3 claims
- 0341US9362173B2Method for chip packageSHI LEI·Filed 2011·Granted Jun 7, 2016·0 cites·17 claims
- 0441US8883627B2Method for chip packagingSHI LEI·Filed 2011·Granted Nov 11, 2014·0 cites·20 claims
- 0537US2013034934A1Wafer level package structure and method for manufacturing the sameSK LINK CO LTD·Filed 2012·Application pending·0 cites
- 0635US2003073264A1Method of manufacturing semiconductor device from semiconductor wafer having thick peripheral portionFUJITSU LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →