Inventor · disambiguated record
Kouji Mizuno
Also filed as: MIZUNO KOUJI
4 granted patents·5 pending applications·60 citations·filing 1998–2022
74Inventor score
Top patents by PatentIndex Score
9 records- 0181US7559265B2Robot arm coupling deviceSTAR SEIKI KK·Filed 2007·Granted Jul 14, 2009·28 cites·17 claims
- 0273US7841059B2Mold attaching/detaching apparatus and mold attaching/detaching methodSTAR SEIKI KK·Filed 2008·Granted Nov 30, 2010·5 cites·3 claims
- 0358US6426800B1Digital image-forming apparatusSHARP KK·Filed 1998·Granted Jul 30, 2002·27 cites·14 claims
- 0448US2021277288A1Pressure-sensitive adhesive tapeNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 0545US11254844B2Pressure-sensitive adhesive tape for protecting semiconductorNITTO DENKO CORP·Filed 2019·Granted Feb 22, 2022·0 cites·4 claims
- 0645US2022228037A1Pressure-sensitive adhesive sheet for protecting semiconductor elementNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0744US2011097576A1Re-peelable adhesive sheetNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 0832US2011030882A1Adhesive sheet for supporting and protecting semiconductor wafer and method for grinding back of semiconductor waferNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 0932US2011030881A1Adhesive sheet for supporting and protecting semiconductor wafer and method for grinding back of semiconductor waferNITTO DENKO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →