Inventor · disambiguated record
Kosuke Morita
Also filed as: MORITA KOSUKE
18 granted patents·28 pending applications·18 citations·filing 2007–2023
89Inventor score
Top patents by PatentIndex Score
46 records- 0180US9659883B2Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor packageNITTO DENKO CORP·Filed 2014·Granted May 23, 2017·2 cites·11 claims
- 0277US8580619B2Method for producing semiconductor deviceNITTO DENKO CORP·Filed 2012·Granted Nov 12, 2013·3 cites·7 claims
- 0372US12473458B2Sealing methodNITTO DENKO CORP·Filed 2020·Granted Nov 18, 2025·0 cites·8 claims
- 0470US9085685B2Under-fill material and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2012·Granted Jul 21, 2015·2 cites·8 claims
- 0567US10305424B2Solar photovoltaic system inspection method and inspection apparatusOMRON TATEISI ELECTRONICS CO·Filed 2015·Granted May 28, 2019·1 cites·17 claims
- 0667US9754894B2Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealingNITTO DENKO CORP·Filed 2014·Granted Sep 5, 2017·2 cites·3 claims
- 0764US2025034433A1Pressure-sensitive adhesive tape and use thereofNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0863US2024191114A1Sealant sheetNITTO DENKO CORPORAITION·Filed 2022·Application pending·0 cites
- 0961US9472439B2Reinforcing sheet and method for producing secondary mounted semiconductor deviceNITTO DENKO CORP·Filed 2014·Granted Oct 18, 2016·1 cites·7 claims
- 1060US9991845B2Ground fault detection deviceOMRON TATEISI ELECTRONICS CO·Filed 2014·Granted Jun 5, 2018·1 cites·26 claims
- 1158US2017306185A1Masking sheet for anodizingNITTO DENKO CORP·Filed 2015·Application pending·0 cites
- 1258US2025361073A1Tube container, tube container with content, and manufacturing method of tube containerFUJI SEAL INT INC·Filed 2023·Application pending·0 cites
- 1358US2017292042A1Masking sheet for chemical solution treatmentNITTO DENKO CORP·Filed 2015·Application pending·0 cites
- 1458US2024391672A1Raw material, film package, and containerFUJI SEAL INT INC·Filed 2022·Application pending·0 cites
- 1557US12234387B2Sealant sheetNITTO DENKO CORP·Filed 2019·Granted Feb 25, 2025·0 cites·5 claims
- 1654US2023040609A1Release-linered sealant sheetNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 1754US2023054230A1LaminateNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 1853US8906746B2Method for producing semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Dec 9, 2014·0 cites·6 claims
- 1951US11891506B2Sealant sheetNITTO DENKO CORP·Filed 2018·Granted Feb 6, 2024·0 cites·12 claims
- 2049US9368421B2Under-fill material and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2015·Granted Jun 14, 2016·0 cites·8 claims
- 2148US2008063955A1Photosensitive resin composition for flexible circuit board and flexible circuit board using the sameNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2246US10128131B2Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Granted Nov 13, 2018·0 cites·4 claims
- 2344US2016056123A1Sealing sheet, method for producing semiconductor device, and substrate with sealing sheetNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2444US2016064297A1Under-fill material, sealing sheet, and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2543US2016035640A1Underfill film, sealing sheet, method of manufacturing semiconductor device, and semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2643US2016013089A1Semiconductor device production method, sheet-shaped resin composition, dicing tape-integrated sheet-shaped resin compositionNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2743US2016075871A1Thermosetting resin composition and method for producing a semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2842USD871573SSolenoid valve for oxygen concentratorSMC CORP·Filed 2019·Granted Dec 31, 2019·2 cites·1 claims
- 2942US2008097000A1Photosensitive resin composition for flexible circuit board and flexible circuit board using the sameNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 3042US2016040045A1Adhesive film for underfill, adhesive film for underfill integrated with tape for grinding rear surface, adhesive film for underfill integrated with dicing tape, and semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 3142US2017125373A1Method for producing semiconductor packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 3242US2017033076A1Production method for semiconductor packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 3342US2017032979A1Production method for semiconductor packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 3442US2015380277A1Underfill sheet, underfill sheet integrated with tape for grinding rear surface, underfill sheet integrated with dicing tape, and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 3541US2013078769A1Method for producing semiconductor deviceNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 3641US2017040287A1Electronic component device production method and electronic component sealing sheetNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 3741US2017040187A1Sealing sheet provided with double-sided separator, and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 3840US2013137219A1Method for producing semiconductor deviceNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 3939US2018233902A1Ground fault detection device, communication device, method for controlling same, load device, switch and non-transitory computer-readable recording mediumOMRON TATEISI ELECTRONICS CO·Filed 2017·Application pending·0 cites
- 4039US2018041164A1Solar power generation system inspection method and inspection apparatusOMRON TATEISI ELECTRONICS CO·Filed 2017·Application pending·0 cites
- 4139US2013157415A1Method for producing semiconductor deviceNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 4238US2012205820A1Encapsulating resin sheet and semiconductor device using the same, and manufacturing method for the semiconductor deviceODA TAKASHI·Filed 2012·Application pending·0 cites
- 4337US9492782B2Oxygen concentratorSMC CORP·Filed 2015·Granted Nov 15, 2016·0 cites·15 claims
- 4437US9480810B2Oxygen concentratorSMC CORP·Filed 2015·Granted Nov 1, 2016·0 cites·15 claims
- 4536USD870882SSolenoid valve for oxygen concentratorSMC CORP·Filed 2017·Granted Dec 24, 2019·1 cites·1 claims
- 4633USD736891SCheck valveMORITA KOSUKE·Filed 2014·Granted Aug 18, 2015·3 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →