Inventor · disambiguated record
Koichiro Mukoyama
Also filed as: MUKOYAMA KOICHIRO
3 granted patents·37 citations·filing 1986–1996
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0149US4938923AGold wire for the bonding of a semiconductor deviceKUJIRAOKA TAKESHI·Filed 1989·Granted Jul 3, 1990·19 cites·6 claims
- 0237US5702814AGold wire for bondingTANAKA ELECTRONICS IND·Filed 1996·Granted Dec 30, 1997·12 cites·8 claims
- 0333US4775512AGold line for bonding semiconductor elementTANAKA ELECTRONICS IND·Filed 1986·Granted Oct 4, 1988·6 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when Koichiro Mukoyama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →