Inventor · disambiguated record
Koji Nasu
Also filed as: NASU KOJI
10 granted patents·2 pending applications·338 citations·filing 1982–2024
91Inventor score
Files withHOSIDEN CORP3MITSUBISHI ELECTRIC CORP2MURATA MANUFACTURING CO2TAKEDA CHEMICAL INDUSTRIES LTD2KYOWA GIKEN1
Top patents by PatentIndex Score
12 records- 0194US6438248B1Hand-free apparatusHOSIDEN CORP·Filed 2000·Granted Aug 20, 2002·139 cites·13 claims
- 0290US6526635B2Cord clipHOSIDEN CORP·Filed 2001·Granted Mar 4, 2003·60 cites·7 claims
- 0382US5366549AMethod for fabricating fiber-reinforced slag gypsum cement-based, lightweight set articlesKYOWA GIKEN·Filed 1994·Granted Nov 22, 1994·63 cites·16 claims
- 0480US6353337B2Load capacitance measuring circuit and output buffer adaptive to wide range of load capacitanceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Mar 5, 2002·25 cites·13 claims
- 0575US7227709B1System and method for providing head amplitude characterizationRENESAS TECH CORP·Filed 2006·Granted Jun 5, 2007·3 cites·10 claims
- 0662US7187956B2Portable communication apparatus and microphone device for the apparatusHOSIDEN CORP·Filed 2002·Granted Mar 6, 2007·7 cites·1 claims
- 0760US4474934AOne-pack type thermosetting polyurethane coating composition from a blocked isocyanate containing an oxadiazinetrione ringTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1982·Granted Oct 2, 1984·13 cites·20 claims
- 0859US6124747AOutput buffer circuit capable of controlling through rateMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Sep 26, 2000·17 cites·11 claims
- 0957US2024204736A1Power amplifierMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1056US2024088847A1Amplification circuit and communication deviceMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 1149US4478894AOne-pack type thermosetting polyurethane coating compositionTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1982·Granted Oct 23, 1984·8 cites·9 claims
- 1232US6215328B1Buffer circuit with small delayMITSUBISHI ELEC SYS LSI DESIGN·Filed 1999·Granted Apr 10, 2001·3 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →