Inventor · disambiguated record
Koichiro Okamoto
Also filed as: OKAMOTO KOICHIRO
12 granted patents·8 pending applications·18 citations·filing 2010–2021
85Inventor score
Top patents by PatentIndex Score
20 records- 0186US9245789B2Method for forming wiringNEC CORP·Filed 2013·Granted Jan 26, 2016·7 cites·10 claims
- 0282US8796659B2Variable resistance element, semiconductor device including variable resistance element, and methods for manufacturing variable resistance element and semiconductor deviceTADA MUNEHIRO·Filed 2011·Granted Aug 5, 2014·2 cites·20 claims
- 0378US8946672B2Resistance changing element capable of operating at low voltage, semiconductor device, and method for forming resistance change elementTADA MUNEHIRO·Filed 2010·Granted Feb 3, 2015·3 cites·10 claims
- 0476US10340451B2Switching element having overlapped wiring connections and method for fabricating semiconductor switching deviceNEC CORP·Filed 2014·Granted Jul 2, 2019·3 cites·14 claims
- 0576US9231207B2Method for forming resistance changing element capable of operating at low voltageNEC CORP·Filed 2014·Granted Jan 5, 2016·2 cites·9 claims
- 0665US9814656B2Porous resin particles, method of manufacturing porous resin particles, and use of porous resin particlesSEKISUI PLASTICS·Filed 2013·Granted Nov 14, 2017·1 cites·22 claims
- 0749US11499018B2Hydrogel, use thereof, and production method thereforSEKISUI PLASTICS·Filed 2018·Granted Nov 15, 2022·0 cites·11 claims
- 0849US2024059810A1Hollow resin particles used in resin composition for semiconductor memberSEKISUI KASEI CO LTD·Filed 2021·Application pending·0 cites
- 0947US10305034B2Variable resistance element and method for producing variable resistance elementNEC CORP·Filed 2016·Granted May 28, 2019·0 cites·10 claims
- 1045US12284755B2Laminate, laminate with buildup layer, laminate with metal foil, and circuit boardSEKISUI KASEI CO LTD·Filed 2020·Granted Apr 22, 2025·0 cites·10 claims
- 1143US2024118609A1Resin composition for solder resist, solder resist film, and circuit boardSEKISUI KASEI CO LTD·Filed 2020·Application pending·0 cites
- 1243US2018319126A1Foamable panel-reinforcing material, production method therefor, and panel-reinforcing methodSEKISUI PLASTICS·Filed 2016·Application pending·0 cites
- 1342US12127485B2Switching element and method for manufacturing sameNANOBRIDGE SEMICONDUCTOR INC·Filed 2020·Granted Oct 22, 2024·0 cites·6 claims
- 1442US2018215956A1Metal panel reinforcement material and method for reinforcing metal panelSEKISUI PLASTICS·Filed 2016·Application pending·0 cites
- 1541US12415895B2Hydrogel and uses thereforSEKISUI KASEI CO LTD·Filed 2019·Granted Sep 16, 2025·0 cites·7 claims
- 1639US9890223B2Resin particles and process for producing same, antiglare film, light-diffusing resin composition, and external preparationNAKAMURA MASAAKI·Filed 2011·Granted Feb 13, 2018·0 cites·21 claims
- 1735US2018163004A1Hydrogel and method for producing sameSEKISUI PLASTICS·Filed 2016·Application pending·0 cites
- 1834US2018230337A1Tacky gel sheet having adhesive applications, method for producing same, method for fixing a pair of objects, and composite materialSEKISUI PLASTICS·Filed 2015·Application pending·0 cites
- 1934US2015221865A1Variable resistance element and method for producing variable resistance elementNEC CORP·Filed 2013·Application pending·0 cites
- 2030US2016359110A1Switching element, and method for producing switching elementNEC CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →