Inventor · disambiguated record
Kooi Choon Ooi
Also filed as: OOI KOOI CHOON
2 granted patents·1 pending application·3 citations·filing 2011–2011
36Inventor score
Top patents by PatentIndex Score
3 records- 0157US8647966B2Method and apparatus for dicing die attach film on a semiconductor waferLIM KEN FEI·Filed 2011·Granted Feb 11, 2014·3 cites·12 claims
- 0229US2013127029A1Two level leadframe with upset ball bonding surface and device packageLEE LEE HAN MENG EUGENE·Filed 2011·Application pending·0 cites
- 0324US8847370B2Exposed die package that helps protect the exposed die from damageLEE LEE HAN MENG EUGENE·Filed 2011·Granted Sep 30, 2014·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →