Inventor · disambiguated record
Kouji Saito
Also filed as: SAITO KOUJI
13 granted patents·3 pending applications·264 citations·filing 1977–2012
93Inventor score
Top patents by PatentIndex Score
16 records- 0183US5535663AOperating valve assembly with pressure compensation valveKOMATSU MFG CO LTD·Filed 1993·Granted Jul 16, 1996·29 cites·3 claims
- 0281US5469746AElectromagnetic flow meterHITACHI LTD·Filed 1994·Granted Nov 28, 1995·53 cites·28 claims
- 0377US4482936ADrawer type enclosed switchboard with automatic grounding deviceMITSUBISHI ELECTRIC CORP·Filed 1983·Granted Nov 13, 1984·29 cites·3 claims
- 0471US5444025AProcess for encapsulating a semiconductor package having a heat sink using a jigFUJITSU LTD·Filed 1994·Granted Aug 22, 1995·39 cites·12 claims
- 0567US5305179ASurface-mounting type semiconductor package having an improved efficiency for heat dissipationFUJITSU LTD·Filed 1992·Granted Apr 19, 1994·39 cites·16 claims
- 0663US4438652AUltrasonic Doppler flowmeterHITACHI LTD·Filed 1982·Granted Mar 27, 1984·14 cites·8 claims
- 0758US5574310ASemiconductor package for surface mounting with reinforcing members on support legsFUJITSU LTD·Filed 1995·Granted Nov 12, 1996·21 cites·14 claims
- 0850US4212702AProcess for recovery of chemicals from pulping waste liquorEBARA MFG·Filed 1978·Granted Jul 15, 1980·6 cites·14 claims
- 0950US2008313367A1Reproducing device of information storage medium reproducing method thereofTOSHIBA KK·Filed 2008·Application pending·0 cites
- 1045US5659200ASemiconductor device having radiator structureFUJITSU LTD·Filed 1995·Granted Aug 19, 1997·11 cites·12 claims
- 1143US5861669ASemiconductor package for surface mountingFUJITSU LTD·Filed 1995·Granted Jan 19, 1999·10 cites·38 claims
- 1242US2012237176A1Optical fiber cableSAITO KOUJI·Filed 2012·Application pending·0 cites
- 1341US2005286864A1Recording and reproducing apparatus and dubbing methodTOSHIBA KK·Filed 2005·Application pending·0 cites
- 1440US5666808AOperating valve assembly with pressure compensation valveKOMATSU MFG CO LTD·Filed 1995·Granted Sep 16, 1997·11 cites·10 claims
- 1531US5831332ASemiconductor package for surface mountingFUJITSU LTD·Filed 1996·Granted Nov 3, 1998·1 cites·21 claims
- 1629US4141785AProcess for recovery of chemicals from pulping waste liquorEBARA MFG·Filed 1977·Granted Feb 27, 1979·1 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →