Inventor · disambiguated record

Kouji Serizawa

Also filed as: SERIZAWA KOUJI

1 granted patent·1 pending application·88 citations·filing 1988–2004

52Inventor score

Technology areasH05K H10W

Files withHITACHI LTD1 NAKATSUKA TETSUYA1

Top patents by PatentIndex Score

2 records

0187US5059559AMethod of aligning and bonding tab inner leadsHITACHI LTD·Filed 1988·Granted Oct 22, 1991·88 cites·21 claims
0236US2006239855A1Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structureNAKATSUKA TETSUYA·Filed 2004·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →