Inventor · disambiguated record
Kohei Seyama
Also filed as: SEYAMA KOHEI
43 granted patents·10 pending applications·68 citations·filing 2006–2021
96Inventor score
Top patents by PatentIndex Score
53 records- 0189US11373975B2Electronic component mounting deviceSHINKAWA KK·Filed 2017·Granted Jun 28, 2022·7 cites·4 claims
- 0284US9406640B2Flip chip bonder and method of correcting flatness and deformation amount of bonding stageSHINKAWA KK·Filed 2015·Granted Aug 2, 2016·5 cites·19 claims
- 0383US7886956B2Bonding apparatus and bonding stage height adjustment method for the bonding apparatusSHINKAWA KK·Filed 2010·Granted Feb 15, 2011·7 cites·6 claims
- 0481US10492351B2Mounting apparatus and measuring methodSHINKAWA KK·Filed 2017·Granted Nov 26, 2019·3 cites·3 claims
- 0578US11509126B2Wiring structure with movement mechanismSHINKAWA KK·Filed 2018·Granted Nov 22, 2022·3 cites·7 claims
- 0678US9536856B2Flip chip bonder and flip chip bonding methodSHINKAWA KK·Filed 2015·Granted Jan 3, 2017·3 cites·15 claims
- 0775US8152043B2Ultrasonic hornKAKUTANI OSAMU·Filed 2011·Granted Apr 10, 2012·3 cites·9 claims
- 0874US9968020B2Electronic-component mounting apparatusSHINKAWA KK·Filed 2015·Granted May 8, 2018·2 cites·2 claims
- 0973US11410866B2Apparatus and method for linearly moving movable body relative to objectSHINKAWA KK·Filed 2018·Granted Aug 9, 2022·2 cites·10 claims
- 1073US10340163B2Mounting apparatusSHINKAWA KK·Filed 2017·Granted Jul 2, 2019·1 cites·9 claims
- 1173US8052026B2Ultrasonic hornSHINKAWA KK·Filed 2006·Granted Nov 8, 2011·4 cites·13 claims
- 1272US11508688B2Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chipsSHINKAWA KK·Filed 2017·Granted Nov 22, 2022·2 cites·15 claims
- 1372US11469125B2Device and method for linearly moving first and second moving bodies relative to target objectSHINKAWA KK·Filed 2018·Granted Oct 11, 2022·2 cites·15 claims
- 1471US10350692B2Heater for bonding apparatus and method of cooling the sameSHINKAWA KK·Filed 2015·Granted Jul 16, 2019·3 cites·9 claims
- 1570US8511534B2Ultrasonic hornKAKUTANI OSAMU·Filed 2011·Granted Aug 20, 2013·2 cites·8 claims
- 1668US10497590B2Electronic component handling unitSHINKAWA KK·Filed 2016·Granted Dec 3, 2019·1 cites·2 claims
- 1768US7735707B2Wire bonding apparatusSHINKAWA KK·Filed 2007·Granted Jun 15, 2010·4 cites·6 claims
- 1867US11664344B2Mounting apparatusSHINKAWA KK·Filed 2018·Granted May 30, 2023·1 cites·7 claims
- 1967US10910248B2Electronic component mounting apparatusSHINKAWA KK·Filed 2016·Granted Feb 2, 2021·1 cites·14 claims
- 2067US10477697B2Mounting apparatusSHINKAWA KK·Filed 2017·Granted Nov 12, 2019·1 cites·6 claims
- 2167US8800843B2Bonding apparatusAOYAGI NOBUYUKI·Filed 2010·Granted Aug 12, 2014·3 cites·16 claims
- 2265US7780056B2Horn attachment armSHINKAWA KK·Filed 2008·Granted Aug 24, 2010·3 cites·6 claims
- 2364US8434656B2Ultrasonic hornKAKUTANI OSAMU·Filed 2011·Granted May 7, 2013·1 cites·16 claims
- 2460US11393700B2Bonding apparatus and bonding methodYAMAHA MOTOR ROBOTICS HOLDINGS CO LTD·Filed 2018·Granted Jul 19, 2022·1 cites·7 claims
- 2560US11302666B2Mounting headSHINKAWA KK·Filed 2017·Granted Apr 12, 2022·1 cites·12 claims
- 2658US7578421B2Horn-holder pivot type bonding apparatusSHINKAWA KK·Filed 2007·Granted Aug 25, 2009·1 cites·15 claims
- 2757US8181527B2Method and apparatus for pass/fail determination of bonding and bonding apparatusAOYAGI NOBUYUKI·Filed 2011·Granted May 22, 2012·1 cites·6 claims
- 2855US12112962B2Arrangement apparatus and arrangement methodSHINKAWA KK·Filed 2020·Granted Oct 8, 2024·0 cites·8 claims
- 2954US12131921B2Manufacturing apparatus of semiconductor deviceSHINKAWA KK·Filed 2021·Granted Oct 29, 2024·0 cites·16 claims
- 3054US10137519B2Flux reservoir apparatusSHINKAWA KK·Filed 2017·Granted Nov 27, 2018·0 cites·2 claims
- 3152US2009272498A1Horn-holder pivot type bonding apparatusSHINKAWA KK·Filed 2009·Application pending·0 cites
- 3251US2024162073A1Mounting apparatus, mounting method, and recording mediumSHINKAWA KK·Filed 2021·Application pending·0 cites
- 3351US2025014921A1Mounting apparatus, mounting method, and recording mediumSHINKAWA KK·Filed 2021·Application pending·0 cites
- 3450US12400993B2Substrate holder and bonding systemSHINKAWA KK·Filed 2020·Granted Aug 26, 2025·0 cites·8 claims
- 3550US10568245B2Electronic-component mounting apparatusSHINKAWA KK·Filed 2017·Granted Feb 18, 2020·0 cites·2 claims
- 3649US12176317B2Semiconductor device manufacturing device and manufacturing methodSHINKAWA KK·Filed 2020·Granted Dec 24, 2024·0 cites·7 claims
- 3748US2024304592A1Bonding apparatus, bonding method, and computer readable storage mediumSHINKAWA KK·Filed 2021·Application pending·0 cites
- 3848US2023273599A1Position control apparatus, position control method, position control recording medium, and bonding apparatusSHINKAWA KK·Filed 2021·Application pending·0 cites
- 3947US11769749B2Mounting apparatusSHINKAWA KK·Filed 2020·Granted Sep 26, 2023·0 cites·7 claims
- 4047US11569192B2Method for producing structure, and structureSHINKAWA KK·Filed 2018·Granted Jan 31, 2023·0 cites·18 claims
- 4147US11410960B2Bonding apparatusSHINKAWA KK·Filed 2018·Granted Aug 9, 2022·0 cites·9 claims
- 4247US2022319891A1Manufacturing apparatus and manufacturing method of semiconductor deviceSHINKAWA KK·Filed 2021·Application pending·0 cites
- 4347US2023268313A1Semiconductor device manufacturing device and manufacturing methodSHINKAWA KK·Filed 2020·Application pending·0 cites
- 4446US12341035B2Mounting deviceSHINKAWA KK·Filed 2020·Granted Jun 24, 2025·0 cites·4 claims
- 4546US2022320034A1Mounting apparatusSHINKAWA KK·Filed 2020·Application pending·0 cites
- 4645US11749541B2Bonding apparatusSHINKAWA KK·Filed 2020·Granted Sep 5, 2023·0 cites·7 claims
- 4743US12191276B2Mounting apparatusSHINKAWA KK·Filed 2020·Granted Jan 7, 2025·0 cites·15 claims
- 4843US9576927B2Bonding tool cooling apparatus and method for cooling bonding toolSHINKAWA KK·Filed 2015·Granted Feb 21, 2017·0 cites·6 claims
- 4941US11139193B2Device and method for positioning first object in relation to second objectSHINKAWA KK·Filed 2018·Granted Oct 5, 2021·0 cites·9 claims
- 5040US11062964B2Method for manufacturing semiconductor device, and mounting apparatusSHINKAWA KK·Filed 2017·Granted Jul 13, 2021·0 cites·19 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →