Inventor · disambiguated record
Koji Shibasaki
Also filed as: SHIBASAKI KOJI
12 granted patents·1 pending application·635 citations·filing 1995–2007
93Inventor score
Top patents by PatentIndex Score
13 records- 0193US6111317AFlip-chip connection type semiconductor integrated circuit deviceTOSHIBA KK·Filed 1997·Granted Aug 29, 2000·157 cites·16 claims
- 0289US5801447AFlip chip mounting type semiconductor deviceTOSHIBA KK·Filed 1996·Granted Sep 1, 1998·107 cites·5 claims
- 0389US5631499ASemiconductor device comprising fine bump electrode having small side etch portion and stable characteristicsTOSHIBA KK·Filed 1996·Granted May 20, 1997·118 cites·12 claims
- 0485US5773888ASemiconductor device having a bump electrode connected to an inner leadTOSHIBA KK·Filed 1995·Granted Jun 30, 1998·84 cites·7 claims
- 0581US5747881ASemiconductor device, method of fabricating the same and copper leadsTOSHIBA KK·Filed 1996·Granted May 5, 1998·54 cites·28 claims
- 0680US5825081ATape carrier and assembly structure thereofTOSHIBA KK·Filed 1996·Granted Oct 20, 1998·60 cites·18 claims
- 0770US6049130ASemiconductor device using gold bumps and copper leads as bonding elementsTOSHIBA KK·Filed 1997·Granted Apr 11, 2000·32 cites·3 claims
- 0866US8128731B2Method for separating and enriching isotope material, multistage rotor, and apparatus for separating and enriching isotope materialMASHIMO TSUTOMU·Filed 2007·Granted Mar 6, 2012·1 cites·15 claims
- 0951US6820503B2High-speed rotation testing apparatusMASHIMO TSUTOMU·Filed 2002·Granted Nov 23, 2004·9 cites·16 claims
- 1044US6615670B2High-speed rotation testing apparatusMARUWA ELECTRONIC INC·Filed 2002·Granted Sep 9, 2003·8 cites·21 claims
- 1135US6061466AApparatus and method for inspecting an LSI device in an assembling process, capable of detecting connection failure of individual flexible leadsTOSHIBA KK·Filed 1996·Granted May 9, 2000·5 cites·15 claims
- 1233US2003015227A1Shock wave generating apparatus and apparatus for removing foreign objects on solid body surface using shock waveKAZUYOSHI TAKAYAMA·Filed 2002·Application pending·0 cites
- 1330US5615822AMethod and apparatus for controlling bonding load of fine lead electrodeTOSHIBA KK·Filed 1995·Granted Apr 1, 1997·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →