Inventor · disambiguated record
Kozo Shimizu
Also filed as: SHIMIZU KOZO
30 granted patents·6 pending applications·289 citations·filing 1986–2023
96Inventor score
Top patents by PatentIndex Score
36 records- 0195US5611481AIntegrated electronic device having flip-chip connection with circuit board and fabrication method thereofFUJITSU LTD·Filed 1995·Granted Mar 18, 1997·97 cites·12 claims
- 0284USD515075SAntenna elementMITSUMI ELECTRIC CO LTD·Filed 2005·Granted Feb 14, 2006·33 cites·1 claims
- 0384US4732631AMethod of manufacturing a tape having a series of surface-type fastener piecesYOSHIDA KOGYO KK·Filed 1986·Granted Mar 22, 1988·44 cites·4 claims
- 0474US8174455B2Antenna element with improved radiation characteristicsMIYOSHI AKIRA·Filed 2009·Granted May 8, 2012·9 cites·11 claims
- 0574US7351361B2Conductive particles, conductive composition, electronic device, and electronic device manufacturing methodFUJITSU LTD·Filed 2005·Granted Apr 1, 2008·5 cites·10 claims
- 0671US9412715B2Semiconductor device, electronic device, and semiconductor device manufacturing methodFUJITSU LTD·Filed 2014·Granted Aug 9, 2016·2 cites·10 claims
- 0770US6740823B2Solder bonding method, and electronic device and process for fabricating the sameFUJITSU LTD·Filed 2002·Granted May 25, 2004·11 cites·1 claims
- 0868US7025906B2Conductive particles, conductive composition, electronic device, and electronic device manufacturing methodFUJITSU LTD·Filed 2002·Granted Apr 11, 2006·13 cites·7 claims
- 0967USD515076SAntenna elementMITSUMI ELECTRIC CO LTD·Filed 2005·Granted Feb 14, 2006·16 cites·1 claims
- 1066US4742969AWinding of flexible elongate materialYOSHIDA KOGYO KK·Filed 1986·Granted May 10, 1988·13 cites·3 claims
- 1163US9305875B2Method of manufacturing semiconductor device capable of enhancing bonding strength between connection terminal and electrodeFUJITSU LTD·Filed 2013·Granted Apr 5, 2016·1 cites·11 claims
- 1262US7119000B2Method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2004·Granted Oct 10, 2006·10 cites·8 claims
- 1362US6608381B1Integrated electronic device having flip-chip connection with circuit board and fabrication method thereofFUJITSU LTD·Filed 2000·Granted Aug 19, 2003·6 cites·9 claims
- 1459US9490232B2Electronic apparatus and method for fabricating the sameFUJITSU LTD·Filed 2014·Granted Nov 8, 2016·0 cites·9 claims
- 1558US12244353B2Optical module switch deviceFUJITSU LTD·Filed 2023·Granted Mar 4, 2025·0 cites·10 claims
- 1657US9812418B2Electronic apparatus and method for fabricating the sameFUJITSU LTD·Filed 2016·Granted Nov 7, 2017·0 cites·2 claims
- 1757US9761552B2Electronic apparatus and method for fabricating the sameFUJITSU LTD·Filed 2016·Granted Sep 12, 2017·0 cites·6 claims
- 1857US7931760B2Whiskerless plated structure and plating methodFUJITSU LTD·Filed 2006·Granted Apr 26, 2011·0 cites·3 claims
- 1956US9530745B2Electronic apparatus and method for fabricating the sameFUJITSU LTD·Filed 2016·Granted Dec 27, 2016·0 cites·4 claims
- 2055US9082756B2Semiconductor device and power source deviceFUJITSU LTD·Filed 2014·Granted Jul 14, 2015·0 cites·8 claims
- 2150US9620470B2Semiconductor device having connection terminal of solderFUJITSU LTD·Filed 2016·Granted Apr 11, 2017·0 cites·3 claims
- 2250US8901751B2Semiconductor device, electronic device, and semiconductor device manufacturing methodFUJITSU LTD·Filed 2012·Granted Dec 2, 2014·0 cites·10 claims
- 2349US6457233B1Solder bonding method, and process of making electronic deviceFUJITSU LTD·Filed 1999·Granted Oct 1, 2002·10 cites·7 claims
- 2448US5977637AIntegrated electronic device having flip-chip connection with circuit boardFUJITSU LTD·Filed 1996·Granted Nov 2, 1999·8 cites·14 claims
- 2547US10167537B2Electronic apparatus and method for manufacturing the sameFUJITSU LTD·Filed 2015·Granted Jan 1, 2019·0 cites·10 claims
- 2646US9640508B2Electrical apparatusFUJITSU LTD·Filed 2015·Granted May 2, 2017·0 cites·17 claims
- 2746US6764938B2Integrated electronic device having flip-chip connection with circuit board and fabrication method thereofFUJITSU LTD·Filed 1999·Granted Jul 20, 2004·7 cites·5 claims
- 2844US2004209453A1Integrated electronic device having flip-chip connection with circuit board and fabrication method thereofFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2942US8728867B2Semiconductor device, manufacturing method of semiconductor device, and power source deviceSHIMIZU KOZO·Filed 2012·Granted May 20, 2014·0 cites·10 claims
- 3042US2019192036A1Electronic device and method of manufacturing electronic deviceFUJITSU LTD·Filed 2019·Application pending·0 cites
- 3140US4840322AWinding of flexible elongate materialYOSHIDA KOGYO KK·Filed 1988·Granted Jun 20, 1989·4 cites·7 claims
- 3238US11217891B2Antenna deviceMONMA Daiki·Filed 2020·Granted Jan 4, 2022·0 cites·3 claims
- 3336US2016354871A1Flux and method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2016·Application pending·0 cites
- 3436US2016228999A1Flux and method of manufacturing electronic deviceFUJITSU LTD·Filed 2015·Application pending·0 cites
- 3535US2001028109A1Solder alloy, a circuit substrate, a semiconductor device and a method of manufacturing the sameFiled 2000·Application pending·0 cites
- 3635US2016233181A1Electronic device and method for manufacturing the sameFUJITSU LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →