Inventor · disambiguated record
Koustav Sinha
Also filed as: SINHA KOUSTAV
15 granted patents·8 pending applications·6 citations·filing 2019–2025
86Inventor score
Top patents by PatentIndex Score
23 records- 0193US11276659B2Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elementsMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 15, 2022·4 cites·15 claims
- 0285US11348875B2Semiconductor devices with flexible connector arrayMICRON TECHNOLOGY INC·Filed 2020·Granted May 31, 2022·2 cites·22 claims
- 0375US2025229351A1Two-step solder-mask-defined designLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 0474US12211814B2Semiconductor interconnect structures with conductive elements, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 28, 2025·0 cites·21 claims
- 0573US12211822B2Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 0673US2025079371A1Semiconductor die assemblies with flexible interconnects and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0772US12218079B2Semiconductor devices with reinforced substratesMICRON TECHNOLOGY INC·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0870US12269106B2Two-step solder-mask-defined designLODESTAR LICENSING GROUP LLC·Filed 2021·Granted Apr 8, 2025·0 cites·12 claims
- 0969US11869862B2Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 9, 2024·0 cites·17 claims
- 1067US11908803B2Semiconductor devices with flexible connector arrayMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 20, 2024·0 cites·11 claims
- 1167US11552029B2Semiconductor devices with reinforced substratesMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 10, 2023·0 cites·11 claims
- 1265US11728307B2Semiconductor interconnect structures with conductive elements, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 15, 2023·0 cites·21 claims
- 1365US11664360B2Circuit board with spaces for embedding componentsMICRON TECHNOLOGY INC·Filed 2021·Granted May 30, 2023·0 cites·11 claims
- 1461US11769752B2Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 26, 2023·0 cites·20 claims
- 1561US11207744B2Two-step solder-mask-defined designMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 28, 2021·0 cites·18 claims
- 1661US2023260943A1Semiconductor die assemblies with flexible interconnects and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1758US2024339496A1Semiconductor dies with rounded or chamfered edgesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1857US2024145337A1Semiconductor device assembly with a thermally-conductive channelMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1957US2025014959A1Microelectronic devices including recesses in an encapsulant material and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2056US2022085002A1Circuit board with spaces for embedding componentsMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 2156US2024407080A1Printed circuit board with enhanced structural supportMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2254US12341110B2Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 24, 2025·0 cites·14 claims
- 2347US11646286B2Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder jointsMICRON TECHNOLOGY INC·Filed 2019·Granted May 9, 2023·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →