Inventor · disambiguated record
Kouichi Takashima
Also filed as: TAKASHIMA KOUICHI
13 granted patents·1 pending application·124 citations·filing 1976–2021
91Inventor score
Top patents by PatentIndex Score
14 records- 0186US6077360ACleaning composition for mold for molding semiconductor device and method of cleaning mold using the sameNITTO DENKO CORP·Filed 1999·Granted Jun 20, 2000·50 cites·20 claims
- 0285US7768120B2Heat spreader and semiconductor device using the sameALMT CORP·Filed 2007·Granted Aug 3, 2010·14 cites·16 claims
- 0377US7180178B2Semiconductor heat-dissipating substrate, and manufacturing method and package thereforSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Feb 20, 2007·7 cites·25 claims
- 0476US7470982B2Substrate for semiconductor device and semiconductor deviceALMT CORP·Filed 2005·Granted Dec 30, 2008·8 cites·8 claims
- 0570US8178893B2Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrateTAKASHIMA KOUICHI·Filed 2006·Granted May 15, 2012·7 cites·18 claims
- 0655US12252766B2Composite material, heat sink and semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Mar 18, 2025·0 cites·6 claims
- 0751US4935175AMold cleaning composition, sheet for cleaning mold, and method for cleaning mold using said cleaning sheetNITTO ELECTRIC IND CO·Filed 1987·Granted Jun 19, 1990·19 cites·12 claims
- 0844US6979901B2Semiconductor heat-dissipating substrate, and manufacturing method and package thereforSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted Dec 27, 2005·1 cites·20 claims
- 0943US4956132AMethod for applying mold-releasing agent onto mold surfaces using a mold-releasing sheetNITTO DENKO CORP·Filed 1988·Granted Sep 11, 1990·11 cites·1 claims
- 1040US2008298024A1Heat spreader and method for manufacturing the same, and semiconductor deviceALMT CORP·Filed 2008·Application pending·0 cites
- 1136US8575625B2Semiconductor element mounting member, method of producing the same, and semiconductor deviceTAKASHIMA KOUICHI·Filed 2012·Granted Nov 5, 2013·0 cites·14 claims
- 1234US4066298AHydraulically transported capsuleHITACHI LTD·Filed 1976·Granted Jan 3, 1978·5 cites·4 claims
- 1330US5990548APlate type member for semiconductor device package and packageSUMITOMO ELECTRIC INDUSTRIES·Filed 1996·Granted Nov 23, 1999·1 cites·16 claims
- 1430US5925605ACleaning composition for mold for molding semiconductor device and method of cleaning mold using the sameNITTO DENKO CORP·Filed 1997·Granted Jul 20, 1999·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →