Inventor · disambiguated record
Kohei Taniguchi
Also filed as: TANIGUCHI KOHEI
3 granted patents·10 pending applications·0 citations·filing 2020–2024
40Inventor score
Top patents by PatentIndex Score
13 records- 0168US2024371832A1Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method thereforRESONAC CORP·Filed 2024·Application pending·0 cites
- 0253US12074139B2Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method thereforRESONAC CORP·Filed 2020·Granted Aug 27, 2024·0 cites·4 claims
- 0348US2025226347A1Adhesive film for semiconductors, dicing die bonding film, and method for producing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0448US2025226348A1Adhesive film for semiconductors, dicing/die-bonding film, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0547US2025157976A1Film-like adhesive and method for producing same, integrated dicing/die bonding film, and semiconductor device and method for producing sameRESONAC CORP·Filed 2023·Application pending·0 cites
- 0647US2025167034A1Integrated dicing/die bonding film, method for producing same, and method for producing semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0746US2025065247A1Coalescer Filter Used in Solvent Extraction MethodMITSUI CHEMICALS ASAHI LIFE MAT CO LTD·Filed 2022·Application pending·0 cites
- 0844US2025293075A1Die bonding film and method for manufacturing same, dicing/die bonding integrated film and method for manufacturing same, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0944US2025006574A1Reinforced semiconductor chip production method, semiconductor chip with film, semiconductor chip reinforcement method, reinforcement film and semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 1043US11935870B2Method for manufacturing semiconductor device having dolmen structure, method for manufacturing support piece, and laminated filmRESONAC CORP·Filed 2020·Granted Mar 19, 2024·0 cites·15 claims
- 1142US12463190B2Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method thereforRESONAC CORP·Filed 2020·Granted Nov 4, 2025·0 cites·20 claims
- 1240US2024043722A1Film-like adhesive agent, dicing/die-bonding all-in-one film, semiconductor device, and method for manufacturing sameRESONAC CORP·Filed 2021·Application pending·0 cites
- 1335US2023395420A1Film adhesive and method for making same; dicing/die bonding integrated film and method for making same; and semiconductor device and method for making sameSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →