Inventor · disambiguated record
Kohei Tatsumi
Also filed as: TATSUMI KOHEI
27 granted patents·9 pending applications·211 citations·filing 1992–2022
96Inventor score
Files withNIPPON STEEL CORP16UNIV WASEDA7ISHIKAWA SHINJI2NIPPON STEEL MATERIALS CO LTD2TEXAS INSTRUMENTS INC2
Top patents by PatentIndex Score
36 records- 0179US5687901AProcess and apparatus for forming ball bumpsNIPPON STEEL CORP·Filed 1995·Granted Nov 18, 1997·54 cites·30 claims
- 0270US8104663B2Solder ball mounting method and apparatusISHIKAWA SHINJI·Filed 2008·Granted Jan 31, 2012·4 cites·8 claims
- 0366US9059003B2Power semiconductor device, method of manufacturing the device and bonding wireNIPPON MICROMETAL CORP·Filed 2013·Granted Jun 16, 2015·2 cites·24 claims
- 0465US7969021B2Bonding wire for semiconductor device and method for producing the sameNIPPON STEEL CORP·Filed 2001·Granted Jun 28, 2011·12 cites·35 claims
- 0563US2024165921A1Joining structure and manufacturing method for sameUNIV WASEDA·Filed 2022·Application pending·0 cites
- 0662US7285486B2Ball transferring method and apparatusNIPPON STEEL MATERIALS CO LTD·Filed 2005·Granted Oct 23, 2007·1 cites·1 claims
- 0761US7045389B1Method for fabricating a semiconductor devices provided with low melting point metal bumpsNIPPON STEEL CORP·Filed 2000·Granted May 16, 2006·9 cites·5 claims
- 0861US5857610AProcess and apparatus for forming ball bumpsNIPPON STEEL CORP·Filed 1997·Granted Jan 12, 1999·22 cites·11 claims
- 0960US6916731B2Ball transferring method and apparatusNIPPON STEEL CORP·Filed 2001·Granted Jul 12, 2005·8 cites·14 claims
- 1060US5639558AInsulating resin-coated bonding wireNIPPON STEEL CORP·Filed 1995·Granted Jun 17, 1997·27 cites·9 claims
- 1157US11810885B2Semiconductor element bonding structure, method for producing semiconductor element bonding structure, and electrically conductive bonding agentUNIV WASEDA·Filed 2021·Granted Nov 7, 2023·0 cites·9 claims
- 1257US2011308371A1Saw wire and method of manufacturing saw wireMORITA MITSURU·Filed 2009·Application pending·0 cites
- 1355US7390370B2Gold bonding wires for semiconductor devices and method of producing the wiresNIPPON STEEL CORP·Filed 2003·Granted Jun 24, 2008·6 cites·22 claims
- 1453US2024128391A1Solar battery module and method for manufacturing sameUNIV WASEDA·Filed 2022·Application pending·0 cites
- 1552US8044408B2SiC single-crystal substrate and method of producing SiC single-crystal substrateNIPPON STEEL CORP·Filed 2009·Granted Oct 25, 2011·0 cites·9 claims
- 1651US2008032495A1Ball transferring method and apparatusNIPPON STEEL MATERIALS CO LTD·Filed 2007·Application pending·0 cites
- 1750US8097960B2Semiconductor mounting bonding wireTERASHIMA SHINICHI·Filed 2008·Granted Jan 17, 2012·0 cites·17 claims
- 1848US9960140B2Metal joining structure using metal nanoparticles and metal joining method and metal joining materialNIPPON STEEL & SUMITOMO METAL CORP·Filed 2014·Granted May 1, 2018·0 cites·17 claims
- 1947US2011107580A1Micro-ball removal method and removal device, and micro-ball collective mounting method and collective mounting apparatusISHIKAWA SHINJI·Filed 2009·Application pending·0 cites
- 2045US11152286B2Power semiconductor module deviceUNIV WASEDA·Filed 2019·Granted Oct 19, 2021·0 cites·8 claims
- 2145US10903146B2Electrode connection structure, lead frame, and method for forming electrode connection structureUNIV WASEDA·Filed 2017·Granted Jan 26, 2021·0 cites·6 claims
- 2245US6909182B2Spherical semiconductor device and method for fabricating the sameBALL SEMICONDUCTOR CORP·Filed 2002·Granted Jun 21, 2005·3 cites·10 claims
- 2345US6509645B2Spherical semiconductor device and method for fabricating the sameNIPPON STEEL CORP·Filed 1999·Granted Jan 21, 2003·10 cites·1 claims
- 2444US9601448B2Electrode connection structure and electrode connection methodUNIV WASEDA·Filed 2016·Granted Mar 21, 2017·0 cites·18 claims
- 2543US6210637B1Gold alloy thin wire for semiconductor devicesNIPPON STEEL CORP·Filed 1998·Granted Apr 3, 2001·10 cites·5 claims
- 2642US6571007B1Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging methodNIPPON STEEL CORP·Filed 1997·Granted May 27, 2003·11 cites·17 claims
- 2742US5803339AProcess and apparatus for forming ball bumpsNIPPON STEEL CORP·Filed 1997·Granted Sep 8, 1998·9 cites·30 claims
- 2842US5554443ABonding wire with heat and abrasion resistant coating layersTEXAS INSTRUMENTS INC·Filed 1995·Granted Sep 10, 1996·11 cites·16 claims
- 2939US2019229103A1Semiconductor deviceUNIV WASEDA·Filed 2019·Application pending·0 cites
- 3038US2005173809A1Wafer-level package and method for production thereofFiled 2005·Application pending·0 cites
- 3138US2002132462A1Spherical semiconductor device and method for fabricating the sameNIPPON STEEL CORP·Filed 2001·Application pending·0 cites
- 3237US7045388B2Semiconductor device provided with low melting point metal bumpsNIPPON STEEL CORP·Filed 1997·Granted May 16, 2006·6 cites·6 claims
- 3336US2002113322A1Semiconductor device and method to produce the sameFiled 2001·Application pending·0 cites
- 3431US6080492AGold alloy thin wire for semiconductor devicesNIPPON STEEL CORP·Filed 1997·Granted Jun 27, 2000·1 cites·9 claims
- 3530US5415922AResin-coated bonding deviceTEXAS INSTRUMENTS INC·Filed 1992·Granted May 16, 1995·5 cites·8 claims
- 3629US6884708B2Method of partially plating substrate for electronic devicesNIPPON STEEL CORP·Filed 1997·Granted Apr 26, 2005·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →