Inventor · disambiguated record
Kok Hou Teh
Also filed as: TEH KOK HOU
2 granted patents·1 pending application·0 citations·filing 2016–2022
22Inventor score
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0147US12512414B2Vertical interconnect design for improved electrical performanceINTEL CORP·Filed 2021·Granted Dec 30, 2025·0 cites·12 claims
- 0247US2024008177A1Vertical interconnect design for improved electrical performanceINTEL CORP·Filed 2022·Application pending·0 cites
- 0336US10971440B2Semiconductor package having an impedance-boosting channelINTEL CORP·Filed 2016·Granted Apr 6, 2021·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →