Inventor · disambiguated record
Kouichi Teshima
Also filed as: TESHIMA KOUICHI
10 granted patents·346 citations·filing 1997–2002
92Inventor score
Top patents by PatentIndex Score
10 records- 0189US6186390B1Solder material and method of manufacturing solder materialTOSHIBA KK·Filed 1998·Granted Feb 13, 2001·67 cites·21 claims
- 0287US6386426B1Solder material and method of manufacturing solder materialTOSHIBA KK·Filed 2000·Granted May 14, 2002·35 cites·15 claims
- 0386US6280858B1Substrate with solder alloy for mounting electronic partsTOSHIBA KK·Filed 2000·Granted Aug 28, 2001·36 cites·22 claims
- 0485US6457632B1Solder alloy and bonding method of substrate and electric or electronic parts with solder alloyTOSHIBA KK·Filed 2000·Granted Oct 1, 2002·32 cites·12 claims
- 0583US6123248ASoldering method and soldering apparatusTOSHIBA KK·Filed 1998·Granted Sep 26, 2000·44 cites·9 claims
- 0681US6464122B1Soldering method and soldering apparatusKURODA TECHNO CO LTD·Filed 2000·Granted Oct 15, 2002·30 cites·5 claims
- 0776US6332909B1Processing apparatus, processing system and processing methodTOSHIBA KK·Filed 1997·Granted Dec 25, 2001·40 cites·21 claims
- 0873US6673310B2Solder material, device using the same and manufacturing process thereofTOSHIBA KK·Filed 2000·Granted Jan 6, 2004·19 cites·11 claims
- 0970US6651870B2Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrateTOSHIBA KK·Filed 2002·Granted Nov 25, 2003·13 cites·15 claims
- 1066US6220501B1Method of joining metallic members, and joined metallic membersTOSHIBA KK·Filed 1998·Granted Apr 24, 2001·30 cites·25 claims
Join the waitlist — get patent alerts
Get an alert when Kouichi Teshima files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →