Inventor · disambiguated record
Koji Tomita
Also filed as: TOMITA KOJI
30 granted patents·7 pending applications·725 citations·filing 1992–2016
97Inventor score
Files withDAINIPPON PRINTING CO LTD6TOCHIGI FUJI SANGYO KK5HITACHI LTD4SOKEN KAGAKU KK4YASKAWA DENKI SEISAKUSHO KK4
Top patents by PatentIndex Score
37 records- 0196US5391439ALeadframe adapted to support semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 1994·Granted Feb 21, 1995·232 cites·11 claims
- 0293US6384909B2Defect inspection method and apparatus for silicon waferHITACHI LTD·Filed 2001·Granted May 7, 2002·47 cites·8 claims
- 0389US6448339B1Adhesive compositionSOKEN KAGAKU KK·Filed 1997·Granted Sep 10, 2002·61 cites·4 claims
- 0489US6157444ADefect inspection apparatus for silicon waferHITACHI LTD·Filed 1998·Granted Dec 5, 2000·89 cites·3 claims
- 0587US5596235ASpindle motor with seal structureNIDEC CORP·Filed 1994·Granted Jan 21, 1997·46 cites·6 claims
- 0680US8445597B2Pressure-sensitive adhesive composition for PDP front filter and use thereofTOMITA KOJI·Filed 2007·Granted May 21, 2013·7 cites·5 claims
- 0780US6256092B1Defect inspection apparatus for silicon waferHITACHI LTD·Filed 1998·Granted Jul 3, 2001·41 cites·8 claims
- 0880US5243842AMethod of making a brazeable metal pipe having tube-insertion apertures formed with guide lugsSHOWA ALUMINIUM CO LTD·Filed 1992·Granted Sep 14, 1993·48 cites·17 claims
- 0979US6683683B2Defect inspection method and apparatus for silicon waferHITACHI LTD·Filed 2002·Granted Jan 27, 2004·13 cites·8 claims
- 1078US8247888B2Semiconductor device and method for manufacturing metallic shielding plateMASUDA MASACHIKA·Filed 2010·Granted Aug 21, 2012·5 cites·13 claims
- 1178US7825189B2Adhesive composition for optical film, adhesive sheet, and optical member using such adhesive compositionSOKEN KAGAKU KK·Filed 2006·Granted Nov 2, 2010·6 cites·15 claims
- 1277US9263374B2Semiconductor device and manufacturing method thereforMASUDA MASACHIKA·Filed 2011·Granted Feb 16, 2016·5 cites·38 claims
- 1377US6506984B2Rotary switch having click mechanismALPS ELECTRIC CO LTD·Filed 2001·Granted Jan 14, 2003·20 cites·7 claims
- 1476US9939037B2Leaf spring frame memberDAINIPPON PRINTING CO LTD·Filed 2014·Granted Apr 10, 2018·4 cites·10 claims
- 1576US6528756B2Laser lap welding process of welding together overlapped plated steel sheetsFUJI HEAVY IND LTD·Filed 2001·Granted Mar 4, 2003·22 cites·7 claims
- 1672US5772418AScrew type compressor rotor, rotor casting core and method of manufacturing the rotorTOCHIGI FUJI SANGYO KK·Filed 1996·Granted Jun 30, 1998·24 cites·7 claims
- 1770US6784632B2Positioning servo controllerYASKAWA DENKI SEISAKUSHO KK·Filed 2001·Granted Aug 31, 2004·15 cites·8 claims
- 1869US8040098B2Position controllerYASKAWA DENKI SEISAKUSHO KK·Filed 2009·Granted Oct 18, 2011·6 cites·2 claims
- 1965US7594175B2Processing instrument and processing instrument systemHITACH HIGH TECHNOLOGIES CORP·Filed 2006·Granted Sep 22, 2009·2 cites·9 claims
- 2062US7851902B2Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2007·Granted Dec 14, 2010·2 cites·25 claims
- 2157US6781340B2Method for detecting oscillation criticality of servo control systemYASKAWA DENKI SEISAKUSHO KK·Filed 2001·Granted Aug 24, 2004·6 cites·8 claims
- 2255US8157347B2Ink jet recording head and ink jet recording head cartridgeINAMOTO TADAYOSHI·Filed 2006·Granted Apr 17, 2012·2 cites·8 claims
- 2354US6801830B1Operation confirming method and device for industrial machineryYASKAWA DENKI SEISAKUSHO KK·Filed 2000·Granted Oct 5, 2004·5 cites·14 claims
- 2452US9257306B2Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2014·Granted Feb 9, 2016·0 cites·30 claims
- 2551US9870983B2Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2016·Granted Jan 16, 2018·0 cites·17 claims
- 2651US2006177651A1Pressure-sensitive adhesive for surface-protective film and surface-protective filmSOKEN KAGAKU KK·Filed 2004·Application pending·0 cites
- 2749US9543169B2Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2016·Granted Jan 10, 2017·0 cites·8 claims
- 2847US2011293953A1Pressure-sensitive adhesive composition for polarizer and polarizer formed using sameTOMITA KOJI·Filed 2009·Application pending·0 cites
- 2945US5797735AFluid machine having balance correctionTOCHIGI FUJI SANGYO KK·Filed 1996·Granted Aug 25, 1998·12 cites·3 claims
- 3043US2010223381A1Identification managing system for authentication of electronic deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 3143US2009165107A1Identification managment system for electronic device authenticationMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 3243US2009235340A1Identification management system for electronic device authenticationMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 3340US2008033109A1Adhesive Composition For Polarizing Plate And Polarizing PlateSOKEN KAGAKU KK·Filed 2005·Application pending·0 cites
- 3435US2012105566A1Printer, print system and printing methodISHII HIROYASU·Filed 2011·Application pending·0 cites
- 3534US5692889AFluid machine having screw rotors with a straight portion to be chuckedTOCHIGI FUJI SANGYO KK·Filed 1996·Granted Dec 2, 1997·3 cites·11 claims
- 3630US5806182AMethod of processing screw rotorTOCHIGI FUJI SANGYO KK·Filed 1996·Granted Sep 15, 1998·2 cites·5 claims
- 3729USRE36949EFluid machine having screw rotors with a straight portion to be chuckedTOCHIGI FUJI SANGYO KK·Filed 1998·Granted Nov 7, 2000·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →