Inventor · disambiguated record

Ko-Po Tseng

Also filed as: TSENG KO-PO

2 granted patents·0 citations·filing 2018–2020

27Inventor score

Technology areasH10P

Files withWINBOND ELECTRONICS CORP2

Top patents by PatentIndex Score

2 records

0155US10847380B2Semiconductor device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Nov 24, 2020·0 cites·11 claims
0251US10665471B2Semiconductor device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2018·Granted May 26, 2020·0 cites·7 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →