Inventor · disambiguated record
Kohsuke Tsuchiya
Also filed as: TSUCHIYA KOHSUKE
21 granted patents·16 pending applications·13 citations·filing 2011–2023
90Inventor score
Top patents by PatentIndex Score
37 records- 0174US9579769B2Composition for polishing purposes, polishing method using same, and method for producing substrateFUJIMI INC·Filed 2012·Granted Feb 28, 2017·3 cites·14 claims
- 0273US9566685B2Polishing composition and method for producing polished articleFUJIMI INC·Filed 2014·Granted Feb 14, 2017·3 cites·10 claims
- 0370US9206336B2Polishing composition, manufacturing process therefor, process for production of silicon substrate, and silicon substrateFUJIMI INC·Filed 2013·Granted Dec 8, 2015·2 cites·4 claims
- 0469US11976220B2Polishing composition and method for producing sameFUJIMI INC·Filed 2022·Granted May 7, 2024·0 cites·14 claims
- 0566US8974691B2Composition for polishing and composition for rinsingTSUCHIYA KOHSUKE·Filed 2011·Granted Mar 10, 2015·2 cites·7 claims
- 0663US10344185B2Composition for polishing silicon wafersFUJIMI INC·Filed 2015·Granted Jul 9, 2019·1 cites·10 claims
- 0760US10351732B2Polishing composition, method for producing polishing composition and polishing composition preparation kitFUJIMI INC·Filed 2014·Granted Jul 16, 2019·1 cites·12 claims
- 0857US11421131B2Polishing composition and method for producing sameFUJIMI INC·Filed 2018·Granted Aug 23, 2022·0 cites·11 claims
- 0955US9028709B2Surface treatment composition and surface treatment method using sameTSUCHIYA KOHSUKE·Filed 2011·Granted May 12, 2015·1 cites·12 claims
- 1052US2025122407A1Polishing compositionFUJIMI INC·Filed 2022·Application pending·0 cites
- 1151US10227518B2Polishing composition and method for producing sameFUJIMI INC·Filed 2014·Granted Mar 12, 2019·0 cites·20 claims
- 1250US9944838B2Polishing composition and method for producing sameFUJIMI INC·Filed 2014·Granted Apr 17, 2018·0 cites·17 claims
- 1350US2016122591A1Silicon wafer polishing compositionFUJIMI INC·Filed 2014·Application pending·0 cites
- 1449US10745588B2Silicon wafer polishing compositionFUJIMI INC·Filed 2017·Granted Aug 18, 2020·0 cites·19 claims
- 1549US2025207030A1Polishing compositionFUJIMI INC·Filed 2023·Application pending·0 cites
- 1648US10717899B2Polishing composition, method for producing polishing composition and polishing composition preparation kitFUJIMI INC·Filed 2018·Granted Jul 21, 2020·0 cites·17 claims
- 1748US2023331930A1Method for producing wetting agent for semiconductor, containing polyvinyl alcohol composition, polishing composition containing wetting agent for semiconductor, obtained by the production method, and method for producing polishing compositionFUJIMI INC·Filed 2021·Application pending·0 cites
- 1847US10748778B2Method for polishing silicon wafer and surface treatment compositionFUJIMI INC·Filed 2019·Granted Aug 18, 2020·0 cites·14 claims
- 1947US2023106868A1Polishing composition and polishing methodFUJIMI INC·Filed 2021·Application pending·0 cites
- 2047US2023143074A1Polishing composition and polishing methodFUJIMI INC·Filed 2021·Application pending·0 cites
- 2145US2022267644A1Method for filtering polishing additive-containing liquid, polishing additive-containing liquid, polishing composition, method for producing polishing composition, and filterFUJIMI INC·Filed 2020·Application pending·0 cites
- 2245US2023174821A1Polishing composition and polishing methodFUJIMI INC·Filed 2021·Application pending·0 cites
- 2343US9505950B2Polishing composition and method for producing substrateFUJIMI INC·Filed 2013·Granted Nov 29, 2016·0 cites·12 claims
- 2443US2022162477A1Polishing compositionFUJIMI INC·Filed 2020·Application pending·0 cites
- 2541US11130883B2Polishing compositionFUJIMI INC·Filed 2017·Granted Sep 28, 2021·0 cites·19 claims
- 2641US9650544B2Polishing composition, method for manufacturing polishing composition, and method for manufacturing polishing composition liquid concentrateFUJIMI INC·Filed 2013·Granted May 16, 2017·0 cites·6 claims
- 2740US9685341B2Abrasive composition and method for producing semiconductor substrateFUJIMI INC·Filed 2013·Granted Jun 20, 2017·0 cites·6 claims
- 2840US2022186078A1Polishing compositionFUJIMI INC·Filed 2020·Application pending·0 cites
- 2940US2015376464A1Polishing composition, method for producing polishing composition and method for producing polished articleFUJIMI INC·Filed 2014·Application pending·0 cites
- 3040US2015166838A1Polishing composition, manufacturing process therefor, undiluted liquid, process for producing silicon substrate, and silicon substrateFUJIMI INC·Filed 2013·Application pending·0 cites
- 3138US2020010727A1Intermediate polishing composition for silicon substrate and polishing composition set for silicon substrateFUJIMI INC·Filed 2018·Application pending·0 cites
- 3237US11332640B2Polishing composition and polishing method using sameFUJIMI INC·Filed 2017·Granted May 17, 2022·0 cites·18 claims
- 3336US11939491B2Method of polishing object to be polished containing material having silicon-silicon bondFUJIMI INC·Filed 2020·Granted Mar 26, 2024·0 cites·12 claims
- 3434US2018030313A1Method for polishing silicon wafer and surface treatment compositionFUJIMI INC·Filed 2016·Application pending·0 cites
- 3534US2019015947A1Polishing composition and method for polishing silicon substrateFUJIMI INC·Filed 2016·Application pending·0 cites
- 3631US10273383B2Polishing composition for silicon wafer and polishing methodFUJIMI INC·Filed 2016·Granted Apr 30, 2019·0 cites·12 claims
- 3730US2013302984A1Polishing composition, polishing method using same, and substrate production methodTSUCHIYA KOHSUKE·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →