Inventor · disambiguated record
Koji Tsuduki
Also filed as: TSUDUKI KOJI
22 granted patents·1 pending application·68 citations·filing 2007–2021
93Inventor score
Top patents by PatentIndex Score
23 records- 0190US8279336B2Solid-state image pickup deviceTSUDUKI KOJI·Filed 2010·Granted Oct 2, 2012·23 cites·20 claims
- 0285US9774769B2Mounted electronic component including connection portionsCANON KK·Filed 2015·Granted Sep 26, 2017·5 cites·20 claims
- 0384US9155212B2Electronic component, mounting member, electronic apparatus, and their manufacturing methodsCANON KK·Filed 2013·Granted Oct 6, 2015·7 cites·20 claims
- 0484US8680669B2Electronic component, electronic module, and method for manufacturing the sameCANON KK·Filed 2012·Granted Mar 25, 2014·5 cites·20 claims
- 0582US9978675B2Package, electronic component, and electronic apparatusCANON KK·Filed 2016·Granted May 22, 2018·5 cites·20 claims
- 0680US8790950B2Method of manufacturing optical sensor, optical sensor, and camera including optical sensorSUZUKI TAKANORI·Filed 2011·Granted Jul 29, 2014·6 cites·7 claims
- 0778US9220172B2Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatusCANON KK·Filed 2013·Granted Dec 22, 2015·5 cites·20 claims
- 0877US10958860B2Module and method of manufacturing moduleCANON KK·Filed 2019·Granted Mar 23, 2021·2 cites·20 claims
- 0975US8309433B2Method of manufacturing optical sensorMATSUKI YASUHIRO·Filed 2011·Granted Nov 13, 2012·2 cites·6 claims
- 1071US7622812B2Semiconductor moduleCANON KK·Filed 2007·Granted Nov 24, 2009·4 cites·7 claims
- 1168US9585287B2Electronic component, electronic apparatus, and method for manufacturing the electronic componentCANON KK·Filed 2014·Granted Feb 28, 2017·2 cites·20 claims
- 1265US11972990B2Unit with wiring board, module, and equipmentCANON KK·Filed 2021·Granted Apr 30, 2024·0 cites·23 claims
- 1361US9209330B2Semiconductor device, method of manufacturing the same, and cameraCANON KK·Filed 2013·Granted Dec 8, 2015·0 cites·12 claims
- 1460US7955903B2Method of suppressing overflowing of an encapsulation resin in a semiconductor moduleCANON KK·Filed 2009·Granted Jun 7, 2011·1 cites·8 claims
- 1558US8823872B2Image pickup module with improved flatness of image sensor and via electrodesTSUDUKI KOJI·Filed 2011·Granted Sep 2, 2014·1 cites·13 claims
- 1655US11164803B2Unit with wiring board, module, and equipmentCANON KK·Filed 2019·Granted Nov 2, 2021·0 cites·20 claims
- 1745US9225882B2Electronic component packaging that can suppress noise and electronic apparatusCANON KK·Filed 2014·Granted Dec 29, 2015·0 cites·20 claims
- 1843US9253922B2Electronic component and electronic apparatusCANON KK·Filed 2013·Granted Feb 2, 2016·0 cites·21 claims
- 1941US8241951B2Method of manufacturing solid-state image pickup device and solid-state image pickup deviceKOMORI HISATANE·Filed 2009·Granted Aug 14, 2012·0 cites·26 claims
- 2040US10319767B2Electronic component including an optical member fixed with adhesiveCANON KK·Filed 2017·Granted Jun 11, 2019·0 cites·15 claims
- 2140US8698938B2Solid-state imaging apparatus, method of manufacturing same, and cameraTSUDUKI KOJI·Filed 2012·Granted Apr 15, 2014·0 cites·11 claims
- 2238US9815133B2Method for producing a moduleCANON KK·Filed 2015·Granted Nov 14, 2017·0 cites·20 claims
- 2335US2016366774A1Electronic component and method for manufacturing electronic moduleCANON KK·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →