Inventor · disambiguated record
Koji Urabe
Also filed as: URABE KOJI
12 granted patents·1 pending application·124 citations·filing 1997–2017
90Inventor score
Top patents by PatentIndex Score
13 records- 0178US6225213B1Manufacturing method for contact holeNEC CORP·Filed 1998·Granted May 1, 2001·43 cites·6 claims
- 0273US6440828B1Process of fabricating semiconductor device having low-resistive contact without high temperature heat treatmentNEC CORP·Filed 1997·Granted Aug 27, 2002·37 cites·8 claims
- 0372US9486959B2Method for producing laminateYOKOHAMA RUBBER CO LTD·Filed 2014·Granted Nov 8, 2016·1 cites·5 claims
- 0452US5998871AMetal plug electrode in semiconductor device and method for forming the sameNEC CORP·Filed 1998·Granted Dec 7, 1999·16 cites·7 claims
- 0548US9505160B2ExtruderYOKOHAMA RUBBER CO LTD·Filed 2014·Granted Nov 29, 2016·0 cites·4 claims
- 0646US6878625B2Method for manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2002·Granted Apr 12, 2005·1 cites·4 claims
- 0742US6174805B1Titanium film forming methodNEC CORP·Filed 1998·Granted Jan 16, 2001·10 cites·12 claims
- 0841US2008211002A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 0938US6383302B2Apparatus and method for manufacturing semiconductor deviceNEC CORP·Filed 1998·Granted May 7, 2002·6 cites·6 claims
- 1036US10746541B2Inspection device for conveyor beltYOKOHAMA RUBBER CO LTD·Filed 2017·Granted Aug 18, 2020·0 cites·8 claims
- 1135US6136692AMethod for forming metal plug electrode in semiconductor deviceNEC CORP·Filed 1999·Granted Oct 24, 2000·5 cites·6 claims
- 1232US6407003B2Fabrication process of semiconductor device with titanium filmNEC CORP·Filed 1998·Granted Jun 18, 2002·3 cites·10 claims
- 1331US6080667AMethod of treating CVD titanium nitride with silicon ionsNEC CORP·Filed 1998·Granted Jun 27, 2000·2 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →