Inventor · disambiguated record
Kohei Yabuta
Also filed as: YABUTA KOHEI
2 granted patents·1 pending application·0 citations·filing 2018–2023
28Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
3 records- 0164US11842968B2Power semiconductor device and substrate with dimple regionMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Dec 12, 2023·0 cites·7 claims
- 0252US2025149413A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0349US11342281B2Power semiconductor device and manufacturing method for power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted May 24, 2022·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →