Inventor · disambiguated record
Kosuke Yazawa
Also filed as: YAZAWA Kosuke
34 granted patents·11 citations·filing 2017–2023
93Inventor score
Files withTDK CORP34
Top patents by PatentIndex Score
34 records- 0191US10381157B2Ceramic electronic deviceTDK CORP·Filed 2018·Granted Aug 13, 2019·5 cites·6 claims
- 0288US10381158B2Electronic deviceTDK CORP·Filed 2017·Granted Aug 13, 2019·3 cites·7 claims
- 0384US10559426B2Electronic device having ceramic element body and external terminalTDK CORP·Filed 2018·Granted Feb 11, 2020·2 cites·13 claims
- 0473US10804035B2Ceramic electronic deviceTDK CORP·Filed 2017·Granted Oct 13, 2020·1 cites·7 claims
- 0570US12062495B2Electronic deviceTDK CORP·Filed 2023·Granted Aug 13, 2024·0 cites·12 claims
- 0666US11302473B2Electronic deviceTDK CORP·Filed 2019·Granted Apr 12, 2022·0 cites·16 claims
- 0766US10984950B2Method of manufacturing electronic device and the sameTDK CORP·Filed 2020·Granted Apr 20, 2021·0 cites·8 claims
- 0865US11961676B2Electronic deviceTDK CORP·Filed 2022·Granted Apr 16, 2024·0 cites·10 claims
- 0965US11798743B2Electronic deviceTDK CORP·Filed 2021·Granted Oct 24, 2023·0 cites·24 claims
- 1065US10777353B2Method of manufacturing electronic device and the sameTDK CORP·Filed 2018·Granted Sep 15, 2020·0 cites·8 claims
- 1164US12340943B2Electronic deviceTDK CORP·Filed 2023·Granted Jun 24, 2025·0 cites·8 claims
- 1262US11508521B2Metal terminal-equipped electronic component and method for producing metal terminal- equipped electronic componentTDK CORP·Filed 2021·Granted Nov 22, 2022·0 cites·6 claims
- 1361US10984953B2Electronic device assemblyTDK CORP·Filed 2019·Granted Apr 20, 2021·0 cites·16 claims
- 1460US11972902B2Electronic apparatus with a metal terminal having portions of differing elasticityTDK CORP·Filed 2022·Granted Apr 30, 2024·0 cites·11 claims
- 1560US10916375B2Electronic deviceTDK CORP·Filed 2019·Granted Feb 9, 2021·0 cites·21 claims
- 1660US10790088B2Electronic deviceTDK CORP·Filed 2019·Granted Sep 29, 2020·0 cites·14 claims
- 1757US10796854B2Electronic deviceTDK CORP·Filed 2019·Granted Oct 6, 2020·0 cites·9 claims
- 1856US11646163B2Electronic deviceTDK CORP·Filed 2021·Granted May 9, 2023·0 cites·11 claims
- 1956US11140781B2Electronic deviceTDK CORP·Filed 2019·Granted Oct 5, 2021·0 cites·10 claims
- 2056US10566139B2Ceramic electronic deviceTDK CORP·Filed 2018·Granted Feb 18, 2020·0 cites·4 claims
- 2155US11527361B2Electronic component with expansion member for preventing overcurrentTDK CORP·Filed 2020·Granted Dec 13, 2022·0 cites·15 claims
- 2254US12002622B2Method for producing resin mold-type electronic component and resin mold-type electronic componentTDK CORP·Filed 2021·Granted Jun 4, 2024·0 cites·5 claims
- 2354US11335508B2Electronic deviceTDK CORP·Filed 2019·Granted May 17, 2022·0 cites·25 claims
- 2454US10840020B2Electronic deviceTDK CORP·Filed 2019·Granted Nov 17, 2020·0 cites·20 claims
- 2553US10763043B2Electronic deviceTDK CORP·Filed 2018·Granted Sep 1, 2020·0 cites·19 claims
- 2652US11495405B2Electronic deviceTDK CORP·Filed 2020·Granted Nov 8, 2022·0 cites·23 claims
- 2752US10714264B2Electronic deviceTDK CORP·Filed 2018·Granted Jul 14, 2020·0 cites·15 claims
- 2851US11367572B2Conductive terminal and electronic deviceTDK CORP·Filed 2020·Granted Jun 21, 2022·0 cites·14 claims
- 2951US11081275B2Electronic deviceTDK CORP·Filed 2019·Granted Aug 3, 2021·0 cites·19 claims
- 3051US10818432B2Electronic deviceTDK CORP·Filed 2018·Granted Oct 27, 2020·0 cites·7 claims
- 3150US11984260B2Electronic device including chip component and caseTDK CORP·Filed 2020·Granted May 14, 2024·0 cites·5 claims
- 3245US10763045B2Electronic deviceTDK CORP·Filed 2017·Granted Sep 1, 2020·0 cites·11 claims
- 3345US10276305B2Ceramic electronic deviceTDK CORP·Filed 2017·Granted Apr 30, 2019·0 cites·6 claims
- 3443US10607778B2Ceramic electronic deviceTDK CORP·Filed 2017·Granted Mar 31, 2020·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →