Inventor · disambiguated record
Koichi Yazima
Also filed as: YAZIMA KOICHI
3 granted patents·436 citations·filing 1998–2000
80Inventor score
Technology areasH10W
Files withTOSHIBA KK3
Top patents by PatentIndex Score
3 records- 0194US6294439B1Method of dividing a wafer and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2000·Granted Sep 25, 2001·139 cites·26 claims
- 0294US5888883AMethod of dividing a wafer and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 1998·Granted Mar 30, 1999·221 cites·8 claims
- 0383US6184109B1Method of dividing a wafer and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 1999·Granted Feb 6, 2001·76 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →