Inventor · disambiguated record
Kota Zenzai
Also filed as: ZENZAI KOTA
26 granted patents·6 pending applications·45 citations·filing 2011–2025
93Inventor score
Top patents by PatentIndex Score
32 records- 0193US8988854B1Multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2014·Granted Mar 24, 2015·19 cites·8 claims
- 0292US9520236B2Multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2015·Granted Dec 13, 2016·6 cites·17 claims
- 0389US10453613B2Conductive resin paste and ceramic electronic componentMURATA MANUFACTURING CO·Filed 2015·Granted Oct 22, 2019·3 cites·20 claims
- 0486US10242802B2Electronic component with an external electrode including a conductive material-containing resin layerMURATA MANUFACTURING CO·Filed 2016·Granted Mar 26, 2019·4 cites·19 claims
- 0585US9202640B2Ceramic electronic component and manufacturing method thereofZENZAI KOTA·Filed 2011·Granted Dec 1, 2015·7 cites·6 claims
- 0684US10062514B2Multilayer ceramic capacitorMURATA MANUFACTURING CO·Filed 2017·Granted Aug 28, 2018·3 cites·20 claims
- 0780US12278050B2Chip ceramic electronic component and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2024·Granted Apr 15, 2025·0 cites·10 claims
- 0876US2025062074A1Ceramic electronic chip component and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0974US10008331B2Multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2016·Granted Jun 26, 2018·1 cites·10 claims
- 1073US12482601B2Method for manufacturing ceramic electronic chip componentMURATA MANUFACTURING CO·Filed 2023·Granted Nov 25, 2025·0 cites·13 claims
- 1172US12243689B2Chip ceramic electronic component and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2021·Granted Mar 4, 2025·0 cites·7 claims
- 1272US9490055B2Ceramic electronic component and manufacturing method thereofZENZAI KOTA·Filed 2011·Granted Nov 8, 2016·2 cites·6 claims
- 1372US2025364184A1Multilayer ceramic capacitorMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 1472US2025372309A1Multilayer ceramic capacitorMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 1569US2024186066A1Chip ceramic electronic component and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1666US12308170B2Method for manufacturing chip ceramic electronic componentMURATA MANUFACTURING CO·Filed 2021·Granted May 20, 2025·0 cites·12 claims
- 1763US11817266B2Conductive paste and ceramic electronic componentMURATA MANUFACTURING CO·Filed 2022·Granted Nov 14, 2023·0 cites·15 claims
- 1861US12469644B2Multilayer ceramic capacitor and bump-producing pasteMURATA MANUFACTURING CO·Filed 2024·Granted Nov 11, 2025·0 cites·20 claims
- 1956US11017950B2Method for producing a ceramic electronic componentMURATA MANUFACTURING CO·Filed 2016·Granted May 25, 2021·0 cites·5 claims
- 2056US2024258029A1Multilayer ceramic capacitor and bump-producing pasteMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 2154US9779876B2Ceramic electronic component and method for producing the sameMURATA MANUFACTURING CO·Filed 2015·Granted Oct 3, 2017·0 cites·7 claims
- 2250US9595375B2Ceramic electronic component and method of manufacturing the sameMURATA MANUFACTURING CO·Filed 2014·Granted Mar 14, 2017·0 cites·7 claims
- 2349US11581137B2Multilayer ceramic electronic component and electrically conductive paste for resin electrodeMURATA MANUFACTURING CO·Filed 2020·Granted Feb 14, 2023·0 cites·8 claims
- 2449US9672963B2Ceramic electronic component and method of manufacturing the sameMURATA MANUFACTURING CO·Filed 2014·Granted Jun 6, 2017·0 cites·8 claims
- 2548US10283273B2Method of manufacturing a ceramic electronic componentMURATA MANUFACTURING CO·Filed 2017·Granted May 7, 2019·0 cites·8 claims
- 2644US9799452B2Ceramic electronic component and method of manufacturing the sameMURATA MANUFACTURING CO·Filed 2014·Granted Oct 24, 2017·0 cites·8 claims
- 2743US11335501B2Multilayer ceramic electronic component and method for producing the sameMURATA MANUFACTURING CO·Filed 2020·Granted May 17, 2022·0 cites·13 claims
- 2843US11205542B2Multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2020·Granted Dec 21, 2021·0 cites·13 claims
- 2942US2021057161A1Multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2020·Application pending·0 cites
- 3041US8988855B2Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particleSAKURADA KIYOYASU·Filed 2011·Granted Mar 24, 2015·0 cites·7 claims
- 3139US9412503B2Electronic component including outer electrodes provided on end portions of a surface of an electronic component bodyMURATA MANUFACTURING CO·Filed 2014·Granted Aug 9, 2016·0 cites·17 claims
- 3233US9941049B2Multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2015·Granted Apr 10, 2018·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Kota Zenzai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →